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Other Thick Film Compositions

Brazing Materials

DuPont makes a unique thick film brazing system for lead attach and seal rings.

CB Series

The CB series of polymer thick film materials can meet a wide range of printed circuit challenges. They are excellent screen printing compostions compatible with manual and semi-automatic equipment. All of the materials are compatible with rigid printed circuit board substrates such as FR-4, CEM-1 and phenolic paper, and many are compatible with flexible substrates such as Kapton® polyimide and Mylar® polyester film.

EMI/RFI Shielding

DuPont Electronic Materials has several new copper-based products and a new carbon product to add to its CB Series Polymer Thick Film (PTF) Pastes.
Two of the new copper PTF pastes - CB200 for rigid circuit boards and CB210 for flexible circuits:

  • provide low-cost alternatives for shielding against electro-magnetic interference (EMI)
  • provide up to 30 percent cost savings compared with traditional EMI shielding options

Circuit designers can reduce layer count, by eliminating one or more copper foil/laminate layers, thus creating thinner circuits which saves materials and processing costs.Because the ground plane created by PTF is typically only one mil away from the circuitry -- compared with a ground plane in a typical multilayer circuit which is at least eight mils away -- the PTF approach often gives high shielding performance.


DuPont's new CB220 (copper) and CB230 (silver/copper) are fully screenable and solderable and can be used on a wide variety of substrates to create fully additive circuits and crossovers. CB050, the new carbon-based product, is a low-cost alternative to gold-plating keypads and connector points.

Encapsulants

Glass Encapsulants are thick film compositions intended to form an insulating and protective layer over thick film circuits, networks, and components. They are applied to ceramic substrates by screen printing and then fired in a conveyor furnace in an oxidizing atmosphere (air).

Glass encapsulants are available in several colors, with one or more of the following features:


  • 500°C-620°C firing
  • 850°C firing
  • Excellent water/acid resistance
  • High to low viscosity
  • Excellent laser trimmability
  • Cd-free
  • Pb-free

Product Disclaimer: This site is a DuPont Microcircuit Materials Global website. However, there may be regional differences, and certain products or services may not be offered in all regions. Please contact your local DuPont representative to find out more about specific products or services available in your region.

Case Study

Multilayer Circuits Using Green Tape™

Green Tape™ Provides High Reliabilty for Satellite Control Circuits