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DuPont Microcircuit Materials

Agenda for "Introduction to Thick Film Technology" Seminar

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Day 1 
Tuesday, 5/6
7:45 am Coffee
8:10 Welcome/Safety
8:25 Manufacturing and Quality Assurance
8:55 Conductor Technology
9:35 Solderable Conductors (including brazing)
10:30 BREAK
10:40 Wire Bonding
11:05 Dielectric Technology
11:35 Photovoltaic Technology)
12:00 LUNCH
12:55 Poklymer Thick Film
1:40 Etchable Thick film Technology
2:00 Fodel® Photoimaging Technology
2:25 BREAK
2:30 Introduction to LTCC
3:15 Lab Tours/Technology Demonstrations
4:45 Adjourn/Shuttle to Doubletree
5:30 Cocktails and Dinner



Thomas Lin
TBD
Ken Souders
Ken Souders

Bryan Neve
John Crumpton
Lynne Dellis

John Crumpton
John Crumpton

Mike Skurski

John Smith  
Day 2 

Wednesday, 5/7

7:55 am Coffee
8:05 Resistor Technology
8:50 Furnace & Firing Technology
9:35 Laser Trimming
10:00 BREAK
10:15 Viscosity and Rheology
10:40 Screen Printing Technology
11:50 LUNCH
1:00 Substrate Interactions
1:25 Multilayer Interconnect Construction
1:45 Lab Tours
3:30 Wrap-Up / Adjourn




Mike Skurski
Derek Eller
Derek Eller

Mark Critzer
Mark Critzer

John Crumpton
Mike Skurski
Mike Skurski