The Experience at PACK EXPO 2012
DuPont shared perspectives on new technologies and our capabilities to cut cost, reduce waste and improve performance at PACK EXPO. Below are highlights from the show and reflections from DuPont technical experts.
DuPont Featured Presentation
Highlights of key global trends and science-based capabilities that DuPont is leveraging to meet the needs of the packaging industry, and our approach to working collaboratively with customers and other stakeholders on critical challenges were presented by Ann Hriciga, Global Application Development Manager. » Based on this presentation, download our white paper, "For Faster, Lower-Cost Package Development, Let's Collaborate," here.
DuPont Technical Experts Reflect on Pack Expo 2012
Read what DuPont Packaging technical experts have to say about Pack Expo 2012.
Equipment With Higher Speeds – Grant Chandlee, Sr. Technical Specialist
Read Grant’s perspectives on the ever-changing state of packaging equipment
Focus Shifts to Value and Collaboration - Aldo Tavarez, Technical Consultant
Learn how conversations are shifting from packaging cost to value and how collaboration is key down the value chain
Sustainability Defined - I-Hwa Lee, Technical Fellow
Read Dr. Lee's take on "sustainability" and companies' shift to providing sustainable functions in their offerings
Nine-Layer Blown Film Line
In addition, we introduced our pilot-scale, nine-layer blown film line which is located at the DuPont Packaging & Industrial Polymers’ application development laboratory in Wilmington. The new line expands our ability to help packaging customers develop new multilayer packaging structures quickly and cost effectively using less material in the testing phase.
Following the presentation and throughout the show, visitors collaborated with our technical folks to talk about issues they face and how our offerings can help and how together we can solve the world's greatest challenges and protecting what matters most.
Our offerings showcased:
- A focus on Polymer Development
- Emerging Technologies
- Packaging Structure Optimization