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Advanced Semiconductor Packaging & Circuit Materials

Semiconductor Packaging & Circuit Materials

DuPont offers a broad and growing portfolio of innovative materials technologies for both ("first level") Semiconductor packaging and ("second level") circuit applications. These cover rigid and flexible printed circuit board manufacturing to ceramic and wafer based processing. We are uniquely positioned to address the increasingly more complex performance requirements through our broad corporate technology base spanning polymers, fibers, photopolymers, dispersions, coatings and film making.

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Get to Know Pyralux® TK

The convergence of flex and high-frequency. Take your circuit designs to new heights with increased speed and flexibility.

 

 

Products & Services

Learn how DuPont's broad portfolio of semiconductor packaging & circuit materials enable the manufacture of different interconnects from printed circuit boards to semconductor packages and modules.» More

Applications

Learn how we have brought our science and industry experience to work with customers in developing innovative and challenging new applications.
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Integrated Wafer Level Packaging Solutions

New technologies meet the most challenging wafer level and flip chip bumping requirements.

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Consumer Electronics

In today’s mobile world, consumers are demanding smaller size, less weight and more functionality from their portable devices.

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Science Connecting Semiconductors

DuPont Semiconductor Packaging & Circuit Materials

Putting science to work in new ways, by developing a broad and growing portfolio of innovative materials...

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