Flexible/Rigid Flex Circuits
Flex Circuit Materials Enable Unique Solutions For Flash Memory Circuit Packaging in Next-Generation Cellular Phones
The challenge was consumer demands for “smart” cellular phones required ever increasing needs for flash memory and RAM driver circuits in shrinking package space as portable phones continue to miniaturize. Our solution was an adhesiveless roll clad laminate to bridge the gap between high performance electrical reliability and unique packaging compatibility to enable low-profile options for critical cellular phone flash memory circuit configurations.
Printed Circuit Boards
DuPont™ Riston® improves the drop resistance of portable devices
To achieve a selective metal finish, the solder joint areas need to be protected by a plating resist before nickel/gold plating. Riston® W250 and FX250 offer optimized performance and compatibility with several plating bath vendors, and has
become the industry standard for critical selective metallization processes such as ENIG plating.
Wafer Level Chip Scale Packaging
Driven by the need for higher density devices and higher speed interconnectivity, the introduction of copper and redistribution layers in these packages created new challenges for the permanent dielectric layer. The solution: HD MicroSystems™ developed a new generation of liquid polyimides, HD-4100, that addressed the unique requirements of WL-CSP applications utilizing copper redistribution layers.