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Advanced Semiconductor Packaging & Circuit Materials

Applications - Displays

Flexible/Rigid Flex Circuits

Enable Chip-On-Glass at your Liquid Crystal Display

The Challenge: Automatic and Accurate Anisotropic Conductive Film (ACF) bonding for Chip-on-Glass Assembly (COG) to Liquid Crystal Displays (LCDs). The Solution: DuPont™ Pyralux® AC and AX laminates and Pyralux® FR and LF coverlays enable flexible circuits with fine pitch, excellent dimensional stability and super flatness to improve not only the first pass yield through production, but also automatic assembly throughput and productivity of ACF bonding of flexible circuits onto LCD Driver IC chips.