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Semiconductor Packaging & Circuit Materials

Applications - Flexible/Rigid Flex Circuits

 

Aerospace/Aircraft 
Reliable Products for Demanding Space Exploration

Pyralux® AP and LF products in space applications for Pioneer.



Exploration of the Planet Mars – Did Life Ever Exist There?

The initial Mars Pathfinder mission demonstrated that unmanned robotic exploration of the surface of Mars was indeed possible.

 

Automotive
High Performance / Reliable Automatic Transmissions Rely on Flex Circuit Cables for a Better Engineered Interconnect

The challenge was to reduce production and assembly costs without compromising reliability. Our solution -DuPont™ Pyralux® LF & FR acrylic adhesive based flex circuit cable assemblies to withstand the harsh environment of an automotive drivetrain.

 

DaimlerChrysler's 7G-Tronic relies on Pyralux®

DaimlerChrysler utlizes a Pyralux® laminated flexible printed circuit board to enable communications between the magnetic values, sensors and floats, the gearbox connector, and the electronics.

 

Consumer Electronics

Flex Circuit Materials Enable Unique Solutions For Flash Memory Circuit Packaging in Next-Generation Cellular Phones

The challenge was consumer demands for “smart” cellular phones required ever increasing needs for flash memory and RAM driver circuits in shrinking package space as portable phones continue to miniaturize. Our solution was an adhesiveless roll clad laminate to bridge the gap between high performance electrical reliability and unique packaging compatibility to enable low-profile options for critical cellular phone flash memory circuit configurations.

 

Computer & Data Processing  
Storage and Easy Access to your Personal Library of Electronic Data at your Fingertips

The challenge was to reduce the size and assembly costs of disk drives to support the demand for substantially increased memory in portable devices. Our solution - DuPont™ Pyralux® FR provides high productivity, clean and precise circuit rigidizers / stiffeners simplifying the disk drive flex circuit design and assembly process



DuPont Pyralux® AP: High Speed Material for a Fast Paced World The challenge was maintaining data transmission integrity as signal speeds increase. DuPont™ Pyralux® AP all-polyimide laminate provides excellent electrical & mechanical properties for minimizing signal loss at high speeds

 

Displays  
Enable Chip-On-Glass at your Liquid Crystal Display

The Challenge: Automatic and Accurate Anisotropic Conductive Film (ACF) bonding for Chip-on-Glass Assembly (COG) to Liquid Crystal Displays (LCDs). The Solution: DuPont™ Pyralux® AC and AX laminates and Pyralux® FR and LF coverlays enable flexible circuits with fine pitch, excellent dimensional stability and super flatness to improve not only the first pass yield through production, but also automatic assembly throughput and productivity of ACF bonding of flexible circuits onto LCD Driver IC chips.

 

Mobile Communications
Clamshell Style Cell Phones Pack Multiple Features and High Resolution Color Displays into Compact Designs

The challenge was improving reliability and folding/flex performance in a small space. Our solution -DuPont™ Pyralux® AC adhesiveless copper clad laminate to provide flexibility and high modulus for through hole reliability.

 

Military
DuPont Adhesiveless Laminate Technology Enables Increasingly Sophisticated Military Electronics Systems

The challenge was high reliability in increasingly complex designs. Our solution - DuPont™ Pyralux® AP enables plated through hole reliability in rigid flex circuitry.

 

Industrial Electronics
Industrial Electronics Unique Product Designs Require Customized Materials to Solve Flex Interconnect Challenges

The challenge was Flex Circuit Materials available with short lead times in a wide variety of constructions. Our solution - DuPont™ Pyralux® LF, FR and AP - copper clad laminate, coverlay & adhesives – Satisfy all ddesign requirements.