The miracles of science™

Select Industry


Advanced Semiconductor Packaging & Circuit Materials

Semiconductor Packaging & Circuit Materials

Applications - Mobile Communications

Flexible/Rigid Flex Circuits  

Clamshell Style Cell Phones Pack Multiple Features and High Resolution Color Displays into Compact Designs

The challenge was improving reliability and folding/flex performance in a small space. Our solution -DuPont™ Pyralux® AC adhesiveless copper clad laminate to provide flexibility and high modulus for through hole reliability.