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Semiconductor Packaging & Circuit Materials

Applications - Semiconductor Packages

 

Consumer Electronics
Wafer Level Chip Scale Packages Driven by the need for higher density devices and higher speed interconnectivity, the introduction of copper and redistribution layers in these packages created new challenges for the permanent dielectric layer. The solution: HD MicroSystems™ developed a new generation of liquid polyimides, HD-4100, that addressed the unique requirements of WL-CSP applications utilizing copper redistribution layers.

 

Flex Circuit Materials Enable Unique Solutions For Flash Memory Circuit Packaging in Next-Generation Cellular Phones

The challenge was consumer demands for “smart” cellular phones required ever increasing needs for flash memory and RAM driver circuits in shrinking package space as portable phones continue to miniaturize. Our solution was an adhesiveless roll clad laminate to bridge the gap between high performance electrical reliability and unique packaging compatibility to enable low-profile options for critical cellular phone flash memory circuit configurations.