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Advanced Semiconductor Packaging & Circuit Materials

Semiconductor Packaging & Circuit Materials

 

Consumer Electronics 
DuPont™ Riston® improves the drop resistance of portable devices

To achieve a selective metal finish, the solder joint areas need to be protected by a plating resist before nickel/gold plating. Riston® W250 and FX250 offer optimized performance and compatibility with several plating bath vendors, and has become the industry standard for critical selective metallization processes such as ENIG plating.