DuPont Electronic Technologies and Sanmina-SCI Sign Licensing Agreement for DuPont™ Interra™ Embedded Passive Materials Use in Buried Capacitance® Technology
|Contact: Ellen Pressley
Ellen G. Pressley@usa.dupont.com
DuPont Electronic Technologies today announced an agreement with Sanmina-SCI to become a licensee of Sanmina-SCI's patented Buried Capacitance® technology. DuPont™ Interra™ HK polyimide laminates can now be used in the practice of Buried Capacitance® technology, available to Sanmina-SCI's existing family of licensed printed circuit board (PCB) manufacturers. The combination of DuPont™ Interra™ planar capacitor laminates and the Sanmina-SCI Buried Capacitance® technology enables smaller, more reliable, high-performing electronics.
"We are excited that DuPont Electronic Technologies has licensed our Buried Capacitance® technology," said George Dudnikov, senior vice president and chief technology officer for Sanmina-SCI's PCB and Backplane Divisions. "Buried Capacitance® technology is an enabler for high-technology printed circuit boards in the telecommunications, high-end computing and military markets. The benefits of using Buried Capacitance® technology can be seen in a variety of areas, particularly in the reduction of high-frequency electromagnetic interface noise and in a quieter power distribution system. Sanmina-SCI continues to develop and invest in leading-edge technologies and this agreement with DuPont Electronic Technologies is one more example of our commitment to the industry."
"We look at this agreement as a winning combination for our customers," said Robert J. O'Connor, global business manager, Embedded Passives, DuPont Electronic Technologies. "DuPont™ Interra™ HK planar capacitor laminates are easy to use and extremely reliable, which is why they are being rapidly integrated into many large scale, high-end application designs. As we continue to put science to work in developing increasingly thinner and higher capacitance density materials to expand the Interra™ embedded passive materials product line, we are pleased to work with technology partners like Sanmina-SCI to contribute to our customers' success."
As designers look to reduce size, improve performance and build more cost-effective electronic devices, they increasingly rely on embedded passive technology, and DuPont Electronic Technologies is creating the broadest portfolio in the world for embedded passive materials under the DuPont™ Interra™ brand. By combining its strengths in laminates, polymer thick films and ceramic paste materials, DuPont has developed the Interra™ embedded passive materials family to include embedded planar capacitor laminates, screen printable polyimide thick film paste products, and ceramic-based screen printable thick film pastes in the broadest range of resistance and capacitance available.
The benefits of using Buried Capacitance® technology can be seen in a variety of areas, particularly in the reduction of high-frequency electromagnetic interface (EMI) noise and in a quieter power distribution system. Even more, Buried Capacitance® potentially reduces many bypass capacitors from the surface of a PCB, which equates to assembly cost reductions along with increasing the available surface area for increased circuit routing density. In support of this, the license offers access to a variety of Buried Capacitance® materials in the 0-4 mil dielectric thickness range, which now includes DuPont™ Interra™ HK04 and HK 11 polyimide laminates.
DuPont Electronic Technologies is a leading supplier of electronic materials, including materials for the fabrication and packaging of semiconductors, materials for rigid and flexible circuits, and materials for advanced displays. For more information about DuPont™ Interra™ embedded passive materials, visit mcm.dupont.com. DuPont is a science company. Founded in 1802, DuPont puts science to work by creating sustainable solutions essential to a better, safer, healthier life for people everywhere. Operating in more than 70 countries, DuPont offers a wide range of innovative products and services for markets including agriculture, nutrition, electronics, communications, safety and protection, home and construction, transportation and apparel.
The DuPont Oval, DuPont™, and The miracles of science™, and Interra™ are registered trademarks or trademarks of DuPont or its affiliates. Buried Capacitance® is a trademark of Sanmina-SCI.