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Advanced Semiconductor Packaging & Circuit Materials

Semiconductor Packaging & Circuit Materials


Research Triangle Park, NC, March 31, 2006

DuPont Semiconductor Packaging & Circuit Materials Appoints Fraunhofer IZM as Key Partner in Applications Development

Ellen Pressley

Applications Testing Ramps up as DuPont Offerings Expand

DuPont Semiconductor Packaging & Circuit Materialstoday announced an applications development agreement with the Fraunhofer Institute for Reliability and Microintegration IZM, one of the leading experts for microelectronics and microsystems packaging worldwide. Fraunhofer will assist in refining and optimizing the process of use for the new and growing line of DuPont materials in wafer level and chip scale packaging.

DuPont materials for semiconductor packaging currently include polyimide-based dielectric materials for redistribution, passivation and stress buffering from joint venture HD Microsystems; Microlithographic Polymer Films composed of temporary and permanent photoimageable dry films for applications such as wafer bumping, backside wafer coating, other wafer level packaging and microelectromechanical systems (MEMS) applications; and a line of cleaners and removers from DuPont EKC Technology. The purpose of the agreement with Fraunhofer is to ensure faster integration of materials as the DuPont offering for packaging applications continues to expand.

"As the growth of wafer level packaging accelerates, our customers face increasingly demanding requirements," said Peter A. Irvine, global business director, DuPont Semiconductor Packaging & Circuit Materials. "DuPont is putting science to work to develop and apply highly engineered materials for critical applications, and we are very pleased to be working with Fraunhofer IZM. They will be instrumental in helping us ensure these materials are tailored to meet the real packaging needs of true leading edge fabricators."

"Fraunhofer IZM has a great deal of experience and leadership in system integration technologies, wafer processing and MEMS technologies, materials and reliability, design and sustainable system development," said Dr. Michael Toepper, head of group microlithography and thin film polymers at Fraunhofer IZM. "Our main objective is to support companies in the broad application of microelectronic and microsystem technologies, and there is a strong fit working together with DuPont. Advanced materials will create new and faster routes to the most desirable destinations along fabricators technology roadmaps."

Fraunhofer will provide applications expertise and fabrication capability to allow DuPont and DuPont customers to develop and demonstrate process and material integration in areas such as bond pad redistribution, wafer bumping and wafer bonding, as well as process aids for cleaning and wafer protection during processing. Fraunhofer will also support DuPont’s new product development efforts and will provide hands on training of personnel.

With more than 230 employees working at seven locations, the Fraunhofer Institute for Reliability and Microintegration IZM is one of the leading institutes in the field of microelectronics and microsystem packaging worldwide. Together with the Technical University Berlin, Fraunhofer IZM bridges the gap between semiconductor technologies and their applications in products. The research focuses on innovative electronic packaging technologies and its industrial applications as well as on creating new technical solutions for advanced electronic system integration.

DuPont Semiconductor Packaging & Circuit Materials is a "domain", or broad based global team, comprised of representatives from DuPont Electronic Technologies, DuPont Fluoroproducts and DuPont Engineering Polymers. By connecting science from across the company, the domain offers a broad and growing portfolio of innovative materials and technologies for both semiconductor packaging and circuit applications, which cover processes ranging from rigid and flexible printed circuit board manufacturing to ceramic and wafer based processing. DuPont is uniquely positioned to address increasingly more complex performance requirements through its broad corporate technology base spanning polymers, fibers, photopolymers, dispersions, coatings and film making. For more information on DuPont Semiconductor Packaging & Circuit Materials, please visit

DuPont is a science company. Founded in 1802, DuPont puts science to work by creating sustainable solutions essential to a better, safer, healthier life for people everywhere. Operating in more than 70 countries, DuPont offers a wide range of innovative products and services for markets including agriculture, nutrition, electronics, communications, safety and protection, home and construction, transportation and apparel.

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