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Advanced Semiconductor Packaging & Circuit Materials

Semiconductor Packaging & Circuit Materials


Research Triangle Park, NC, April 2, 2006

DuPont Advanced Packaging Lithography Appointed As U.S. Representative for Microcontrol Electronic Equipment

Ellen Pressley

Equipment and Film Combination Offers New Options in Semiconductor Packaging

DuPont Advanced Packaging Lithography, part of DuPont Electronic Technologies, announced it has been appointed the U.S. sales representative for Microcontrol Electronic’s line of Leonardo® tape laminator systems. Leonardo® tape laminator systems are designed for use with DuPont™ MPF microlithographic polymer films and are used in wafer bumping, backside wafer coating, other wafer level packaging and microelectromechanical systems (MEMS) applications. The sales representation arrangement is a key new partnership that complements and further expands the DuPont offering for semiconductor packaging applications.

"This combined material and equipment set enables packagers to take advantage of inherent dry film benefits such as thickness control, thickness uniformity, and productivity to improve yields and reduce cost, especially in large wafer processing," said Mats J. Ehlin, global manager for DuPont Advanced Packaging Lithography. "DuPont™ MPF thick photoimageable dry films allow solvent free application of up to 120 micron thick resist in a single layer, with aqueous based developer and remover processing, up to 5:1 aspect ratio resolution, and excellent CD control. When MPF is applied with a Microcontrol Leonardo® 200 or 300 tape laminator system, wafer handling is reliable, safe and smooth, plus, it improves the productivity and enhances the performance of the film."

"Microcontrol shares a spirit of innovation with DuPont, and we’re very pleased to have them as our partner in the United States, said Mario Cairella, Microcontrol’s president. "We’re confident that the quality of our Leonardo® equipment line, along with the quality of DuPont™ MPF films, will have a positive impact on semiconductor packaging, especially where the value is in large wafer processing."

Microcontrol Electronic’s experience is based on more than 20 years in manufacturing tape lamination equipment for the semiconductor industry, and sales of hundreds of systems worldwide. For more information on Microcontrol Electronic, please visit

DuPont offers a broad and growing portfolio of innovative materials technologies for both semiconductor packaging and circuit applications. These cover rigid and flexible printed circuit board manufacturing to ceramic and wafer based processing. DuPont is uniquely positioned to address the increasingly more complex performance requirements through our broad corporate technology base spanning polymers, fibers, photopolymers, dispersions, coatings and film making.

DuPont Advanced Packaging Lithography is part of DuPont Electronic Technologies, a leading supplier of electronic materials, including materials for the fabrication and packaging of semiconductors, materials for rigid and flexible circuits, and materials for advanced displays. For more information on DuPont Electronic Technologies, please visit

DuPont is a science company. Founded in 1802, DuPont puts science to work by creating sustainable solutions essential to a better, safer, healthier life for people everywhere. Operating in more than 70 countries, DuPont offers a wide range of innovative products and services for markets including agriculture, nutrition, electronics, communications, safety and protection, home and construction, transportation and apparel.


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Leonardo® is a registered trademark of Microcontrol Electronic.