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Advanced Semiconductor Packaging & Circuit Materials

Semiconductor Packaging & Circuit Materials

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Tokyo, Japan, January 18, 2007

DuPont Semiconductor Packaging and Circuit Materials Participated in InterNepcon Japan

DuPont showcased its expanding portfolio of materials for Semiconductor Packaging and Circuit Materials at InterNepcon Japan 2007. This year’s show was held at Tokyo Big Sight on January 16-18, 2007. NepconWorld Japan is Asia’s largest electronics manufacturing exhibition.

Several DuPont businesses highlighted their products for printed wiring boards, including Pyralux® Flexible Circuit Materials, Microlux™ HP, Vespel® Parts and Shapes, and DuPont Imaging Materials.

DuPont connects science and technology from across the company to offer one of the broadest portfolios of innovative materials and advanced process expertise available for semiconductor fabrication, manufacture and packaging.