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Advanced Semiconductor Packaging & Circuit Materials

Semiconductor Packaging & Circuit Materials


Research Triangle Park, NC, January 2, 2008

DuPont Participated in Advanced Packaging Technology Roadshow in Asia

DuPont Advanced Packaging Lithography presented at "Small-Dimensions – Big Results", a tour hosted by SUSS MicroTec to highlight recent developments in MEMS, Advanced Packaging and 3-D Integration.

The tour highlighted recent developments in MEMS, Advanced Packaging and 3D Integration. Participants had the opportunity to hear presentations on high aspect ratio lithography and plasma etching, wafer bonding, dry release processing and wafer level testing.

The seminars were at various locations in Asia from October 26-November 7.

click on link to view the DuPont presentation "Dry Film Photoresist and Material Solutions for 3D/TSV."