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Advanced Semiconductor Packaging & Circuit Materials

Semiconductor Packaging & Circuit Materials


Research Triangle Park, NC, January 15, 2008

DuPont to Exhibit at Internepcon 2008

DuPont will feature its flexible printed circuit offering at Internepcon Japan Printed Wiring Board Expo. This year’s show will be held at the Tokyo Big Sight on January 16-18, 2008.

Internepcon Japan is Asia's largest exhibition to feature equipment, materials and technologies for electronics manufacturing.

Please stop by DuPont booth #20-11 to learn about electronics technology from several DuPont businesses, including:

  • DuPont™ Kapton® – DuPont™ Kapton® polyimide film is used as a substrate in the flexible circuit industry. Its long flex life and ability to withstand copper etching makes it excellent choice for these applications. FPC film is used heavily in the electronics market as the industry moves to smaller, lighter and faster components.
  • DuPont™ Pyralux® – DuPont™ Pyralux® AC, AK and LF type laminates are used to produce high reliability, high density circuitry of flexible, rigid-flex, and all-flexible multilayer constructions.
  • DuPont Advanced Packaging Lithography – DuPont APL offers Microlithographic Polymer Films (MPF) and dry film photoresists designed for advanced semiconductor packaging, wafer level packaging and MEMS applications.

For more information, on Internepcon Japan and cooresponding shows, please visit