Research Triangle Park, NC, June 23, 2008
DuPont to Feature Semiconductor Materials at SEMICON West 2008
DuPont will exhibit its portfolio of advanced material technologies for semiconductor fabrication and packaging at SEMICON West in San Francisco, July 15-17, 2008.
DuPont EKC Technology will be featured as part of the SEMICON West Technology Innovation Showcase, in the North Hall, with a Tech XPOT presentation on Tuesday, July 15 at 12:30 pm.
» View the abstract
Please visit DuPont Booth 1807 to learn about semiconductor technology from several DuPont businesses, including:
- DuPont™ Kalrez® Perfluoroelastomer Parts for reduced contamination and longer seal life in aggressive wafer manufacturing environments.
- DuPont™ Teflon® Fluoropolymers offers technology and products that provide a range of properties including use temperatures, component or part design flexibility, universal chemical resistance and purity levels designed to meet the needs of the semiconductor industry.
- EKC Technology, specialty chemicals used in the removal of photoresist and post-dry etch process residue in the semiconductor industry.
- DuPont AirProducts NanoMaterials , for electronic polishing applications in the semiconductor manufacturing market.
- DuPont Wafer Level Packaging dry film photoresist and dry film remover provide a step change in precise wafer bumping formation and clean resist removal for wafer bumping and flip chip bumping.
- Hybrid Membrane Technologies nanofiber nonwoven filtration media fill the gap in retention and flow between tradition nonwovens and membrane technologies.
For more information on SEMICON West, please visit www.semiconwest.org
EKC Tech XPOT abstract:
Topic: Cleaning Challenges - BEOL Hard Mask Integration
Shrinking interconnect geometries require non-photoresist masking materials during plasma patterning. However, the use of, for example, metal hardmasks increases the demands on subsequent wet clean steps. The residues created during hardmask etching are tenacious and require highly selective cleaning to increasingly sensitive dielectrics and metals. This presentation will review these technical hurdles and present data addressing them.