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Advanced Semiconductor Packaging & Circuit Materials

Semiconductor Packaging & Circuit Materials

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Danville, CA, July 11, 2008

DuPont EKC Technology Introduces New EKC162™ Photoresist Remover for Advanced Semiconductor Packaging

  Contact:
Ellen Pressley
919-248-5598
ellen.g.pressley@usa.dupont.com

EKC Technology, part of DuPont Electronic Technologies, will introduce a new photoresist remover for Through Silicon Via (TSV) and Wafer Level Packaging (WLP) for copper pillar and solder bump applications at SEMICON West in San Francisco, July 15-17. This represents the latest innovation in the broad and growing portfolio of DuPont products for both semiconductor fabrication and packaging.

DuPont™ EKC162™ photoresist remover efficiently removes and dissolves DuPont dry films faster and at lower temperature than typical removers without attacking polyimide or metal layers.   It has been formulated to enhance the removal of resists cleanly and efficiently, with full dissolution.  DuPont™ EKC162™ photoresist remover also prevents redeposition while minimizing damage to metal conductors, bumps and redistribution layer dielectrics. EKC Technology’s WLP photoresist removers are a tested and proven solution for area array packaging requirements whether stencil printed, plated, pillared or C4 applied.

“This innovation is consistent with our strategy to expand into adjacent semiconductor cleaning applications, including wafer bumping and through silicon via processes,” said Douglas Holmes, director of marketing, DuPont EKC Technology. “EKC is a leading provider of advanced cleaning solutions for back end of line interconnect resist and residue removal.   In close cooperation with the DuPont Advanced Packaging Lithography team, EKC has applied its extensive experience to address the growing wafer level packaging segment.”

Other characteristics and benefits of DuPont™ EKC162™ photoresist remover include:

  • Water rinseable, semi-aqueous solution;
  • Co-designed with DuPont™ WB Series Dry Film to strip in half the time of competitive removers;
  • Fully compatible with HD MicroSystems™ PI and PBO redistribution dielectrics;
  • Removes uncured HD-4000 series polyimide;
  • Exhibits an extended bath life;
  • Easy rework of partially stripped resist;
  • Wet bench and spray tool compatible;
  • POR (Process of Record) for high end logic devices in production.

For more information, please visit http://wlpsolutions.dupont.com.

EKC Technology is part of DuPont Electronic Technologies, a leading supplier of electronic materials, including materials for the fabrication and packaging of semiconductors, materials for hybrid, rigid and flexible circuits, and materials for advanced displays. 

DuPont is a science-based products and services company.  Founded in 1802, DuPont puts science to work by creating sustainable solutions essential to a better, safer, healthier life for people everywhere.  Operating in more than 70 countries, DuPont offers a wide range of innovative products and services for markets including agriculture and food; building and construction; communications; and transportation.