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Semiconductor Packaging & Circuit Materials

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RESEARCH TRIANGLE PARK, NC, January 29, 2009

DuPont Wafer Level Packaging Solutions, Nippon Kayaku and MicroChem Sign Joint Development Agreement

3D and TSV Semiconductor Packaging Designs Drive Demand for New Photodefinable Epoxy Based Materials

Contacts:
DuPont

Ellen Pressley
919-248-5598
E-mail

Nippon Kayaku
Mr. Hirotsugu Tsubouchi
+ 03-3237-5045
E-Mail
 
MicroChem
Scott Heidemann
617-831-2317
E-Mail 

DuPont Wafer Level Packaging (WLP) Solutions (http://wlpsolutions.dupont.com), part of DuPont Electronic Technologies, and Nippon Kayaku Co. Ltd. (NKC), together with NKC’s wholly owned subsidiary, MicroChem Corp. have signed a Joint Development Agreement to develop new advanced photodefinable epoxy based materials directed to emerging WLP and 3D/Through-Silicon Via (TSV) applications. DuPont WLP Solutions and MicroChem have developed a first generation photodielectric adhesive dry film material that will soon be commercialized as DuPont™ PerMX™ 3000. With new advanced epoxy resins from Nippon Kayaku, the largest supplier of epoxy resins for microelectronic applications, the companies expect to accelerate product development and introduce a series of new materials over the next five years.

DuPont estimates the materials market for wafer level packaging, 3D and TSV to grow from about $100 million in 2009, to more than $600 million in 2013, and could as much as double to $1.2 billion by 2015.

"Combining the expertise of Nippon Kayaku and MicroChem in advanced epoxy resins and formulation, with DuPont coating technology, material science and electronic applications knowledge means that we can generate a series of enabling materials faster," said Mats J. Ehlin, global business manager -- DuPont Wafer Level Packaging Solutions. "We’re excited about this opportunity to further expand our offering and strengthen our ability to help customers meet their needs for improved performance, form factor and reduced cost."

Applications for the DuPont™ PerMX™ photodielectric adhesive dry film series include CMOS image sensor packaging and wafer level camera modules, wafer level cavity packages for electronic components, MEMS devices and LED displays, bonding for 3D packaging, and various dielectric layers for new advanced wafer level chip scale packages (WLCSP).  

"Nippon Kayaku Co. is widely acknowledged for its experience in epoxy resin and formulation for semiconductor packaging," said Masaru Oizumi, general manager -- Electronic Materials Division, Nippon Kayaku Co., Ltd.  "This joint development requires new high performance epoxy resins and formulations, and I believe our experience will contribute to expand new business opportunities, including the development of MEMS resists. MicroChem also will support and accelerate our new product developments."

3D/TSV packaging technology is emerging as a leading solution to extend Moore’s law by significantly improving performance, further reducing form factors, and eventually providing even more cost effective methods for the packaging of semiconductor devices such as advanced memory, logic and SiP (System in Package).

Wafer level packaging is spreading rapidly as a way to significantly improve the efficiency and reduce the size of semiconductor packages. Rather than package and test single components, the packaging process takes place on the semiconductor wafer before each semiconductor chip is singulated. For example, DuPont™ PerMX™ photodielectric adhesive dry films can enable wafer level packaging of new CMOS cameras or radio frequency components by creating a protective cavity around each chip in a single process involving thousands of components on a wafer. Glass or a second layer of DuPont™ PerMX™ photodielectric adhesive dry film can be bonded on top, without any additional need for adhesives, prior to singulation of each component.

About Nippon Kayaku:  Since its founding in 1916, from a base in the fine chemicals business, the Nippon Kayaku Group has continued to expand into a broad range of new fields, including explosives, dyes, pharmaceuticals, agrochemicals, functional products, catalysts, and automobile safety parts to business resources and continually improving to meet the needs of the rapidly changing times.  Looking to the future, Nippon Kayaku has positioned its functional chemicals business, for growth in the information / communications field, its pharmaceuticals business for growth in the health care field, and its safety systems business for growth in the automotive safety field. Another growth field is in the area of new energy, where growth is expected and a number of Nippon Kayaku technologies can be applied to good use.

MicroChem Corp is a producer and distributor of specialty electronic chemicals used in the production of semi-conductors, micro-electromechanical systems (MEMS), and in other electronic applications. The company’s primary focus is photosensitive materials, such as photoresists, and associated ancillary products. MicroChem technology consists of proprietary and non-proprietary products requiring state-of-the-art technical expertise, consistent reproducibility and high purity. For more information please visit http://www.microchem.com

DuPont Wafer Level Packaging Solutions is part of DuPont Electronic Technologies, a leading supplier of electronic materials, including materials for the fabrication and packaging of semiconductors, materials for hybrid, rigid and flexible circuits, and materials for advanced displays. For more information, please visit http://wlpsolutions.dupont.com.

DuPont is a science-based products and services company. Founded in 1802, DuPont puts science to work by creating sustainable solutions essential to a better, safer, healthier life for people everywhere. Operating in more than 70 countries, DuPont offers a wide range of innovative products and services for markets including agriculture and food; building and construction; communications; and transportation.

Forward-Looking Statements:  This news release contains forward-looking statements based on management’s current expectations, estimates and projections.  All statements that address expectations or projections about the future, including statements about the company’s strategy for growth, product development, market position, expected expenditures and financial results are forward-looking statements.  Some of the forward-looking statements may be identified by words like “expects,” “anticipates,” “plans,” “intends,” “projects,” “indicates,” and similar expressions.  These statements are not guarantees of future performance and involve a number of risks, uncertainties and assumptions.  Many factors, including those discussed more fully elsewhere in this release and in DuPont’s filings with the Securities and Exchange Commission, particularly its latest annual report on Form 10-K, as well as others, could cause results to differ materially from those stated.  These factors include, but are not limited to changes in the laws, regulations, policies and economic conditions of countries in which the company does business; competitive pressures; successful integration of structural changes, including acquisitions, divestitures and alliances; research and development of new products, including regulatory approval and market acceptance, and seasonality of sales of agricultural products.