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Advanced Semiconductor Packaging & Circuit Materials


Shanghai, China, February 26, 2010

DuPont Exhibits at CPCA 2010 Shanghai, China

Contact: Ellen G. Pressley

DuPont will be featuring its broad offering of technologies for the Printed Circuit Board (PCB) industry at CPCA 2010 in Shanghai, China, March 16 - 18, 2010. Dry film photoresists and phototools for PCB imaging, new Kapton® polyimide films for flexible printed circuits, CooLam™ thermal substrates for high brightness LED lighting, an expanded line of Pyralux® flexible circuit materials, and new CB Series screen printed ink materials will be highlighted.

DuPont Circuits & Packaging Materials Booth at CPCA Shanghai