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Advanced Semiconductor Packaging & Circuit Materials

Semiconductor Packaging & Circuit Materials

DuPont Features New Products at IPC APEX Expo 2010

DuPont recently exhibited at the IPC APEX Conference & Exhibition, held April 6 - 8, 2010 at Mandalay Bay in Las Vegas.

By connecting science and technology from across the company and around the world, DuPont continues to deliver advanced material solutions for the Printed Circuit Board (PCB) industry.

We highlighted several new offerings, including:

CB Series screen printed ink materials DuPont introduced two new products in the DuPont CB Series family of screen printable inks for additive, low temperature processing on both rigid and flexible circuit boards, including a printed silver conductor ink designed to simplify selective electroplating applications, and an additive, plateable silver conductor that can be used as an overprint for via fills.  » Learn More 

Pyralux® flexible circuit materials DuPont launched Pyralux® TK - a new high speed flexible laminate material for use in high speed digital and high frequency applications, which is available in a variety of thicknesses, with a dielectric constant as low at 2.3 and a dissipation factor down to 0.002.  »  Learn More

 Pyralux® AP-PLUS, an expanded line of Pyralux® AP flexible circuit material will also be highlighted, with special focus on thicker polyimides. These thicker versions of the well-established Pyralux® AP product line allow more flexibility to designers when impedance control specifications become a limiting factor.

Pyralux® APR embedded resistor laminates were also featured.

Idealine™ Silver Halide phototooling film New Idealine™ HPF silver halide phototooling plotter film with unsurpassed performance characteristics was introduced, which is designed to image finer lines and features while also providing improved dimensional stability. » Learn More 

Riston® dry film photoresistsDuPont featured Riston® PlateMaster PM300 dry film photoresist the next generation fine line copper/tin and copper/solder plating film. Excellent resolution and wide processing latitude give PCB fabricators the ability to produce more demanding plated features.

It also highlighted the latest in the successful Riston® SpecialFX series of dry film photoresists, Riston® FX2000, which is designed to produce new, higher resolution innerlayers demanded of leading edge printed circuit boards.

Additionally, DuPont featured Riston® LaserSeries LDI7200 designed to provide superior performance on today's laser direct imaged outerlayer boards.  The capability of the film in a broad range of plating solutions (copper, tin, solder, nickel, gold) and its availability in thicknesses ranging from 40 microns to 100 microns, enables fabricators to use one film to meet all of their LDI needs.