Santa Clara, CA, February 4, 2008
DuPont™ Interra™ to Participate in DesignCon 2008
DuPont™ Interra™ Embedded Passive Materials will exhibit at DesignCon 2008 at the Santa Clara Conference Center in California. The conference will be held from February 4-7.
Visit DuPont Booth 924 to learn about our Interra™ HK 04 product line for the digital design community.
DesignCon is a forum for the latest design techniques, tools and products for professionals in the semiconductor and electronic design industries.
For more information on DesignCon 2008,please visit www.designcon.com/2008
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