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Semiconductor Packaging & Circuit Materials News & Events May 25, 2009HD MicroSystems™ Introduces HD-8930 Ultra-Low Cure PBO for Wafer Level Semiconductor Packaging The new offering is the latest in the HD-8900 low-cure PBO series and combines the proven reliability of HD MicroSystems’ PBO technology with curing temperatures as low as 200°C. With its low modulus and high elongation, HD-8930 achieves superior drop test results, making it ideal for use in portable electronic devices. » More March 2, 2009 DuPont highlights Wafer Level Packaging Solutions at IMAPS Device Packaging 2009 Conference DuPont will feature new ultra-low cure dielectric materials for WLP and 3D/TSV applications, and spotlight advanced material sets and process technologies for Fan Out, 3D/TSV, RDL, Bonding and Bumping applications. »More January 29, 2009DuPont Wafer Level Packaging Solutions, Nippon Kayaku and MicroChem Sign Joint Development Agreement Joint Development Agreement to develop new advanced photodefinable epoxy based materials directed to emerging WLP and 3D/Through-Silicon Via (TSV) applications. »More November 19, 2008DuPont Microcircuit Materials Introduces New Offering for Printed Electronics Silver Conductive Ink Designed as Cost-Effective Solution for RFID Antennae, Biosensors, Membrane Touch Switch Applications and More. »More October 23, 2008DuPont to Participate in Technical Sessions at Taiwan Printed Circuit Association (TPCA) Learn about DuPont products such as Riston® dry film photoresists, Kapton® polyimide film, Coolam™ parts, Pyralux® polyimide laminate, and Ultimax™ for printed circuit board manufacture. »More September 23, 2008DuPont Electronic Technologies Expands Wafer Level Packaging Solutions DuPont Electronic Technologies has announced a new expansion focused on material solutions for wafer level packaging (WLP) and emerging three dimensional (3D) and Through Silicon Via (TSV) semiconductor packaging applications »More September 9, 2008DuPont Microcircuit Materials Features Enabling Technologies at the FISITA World Automotive Conference DuPont Microcircuit Materials (MCM), part of DuPont Electronic Technologies, will exhibit the latest innovations in automotive electronic ceramic circuits using DuPont thick film compositions at the FISITA World Automotive Conference. »Deutsch July 11, 2008DuPont EKC Technology Introduces New EKC162™ Photoresist Remover for Advanced Semiconductor Packaging EKC Technology will introduce a new photoresist remover for Through Silicon Via (TSV) and Wafer Level Packaging (WLP) for copper pillar and solder bump applications at SEMICON West. »More June 23, 2008DuPont to Feature Semiconductor Materials at SEMICON West 2008 DuPont will exhibit its portfolio of advanced material technologies for semiconductor fabrication and packaging at SEMICON West in San Francisco, July 15-17, 2008. »More June 11, 2008DuPont Electronic Technologies Announces Global Price Increase DuPont Electronic Technologies cites rising raw material, transportation and energy costs among its reasons for the increase. »More May 27, 2008DuPont Microcircuit Materials Showcases full range of Innovative Materials for Automotive Electronics at SMT 2008 Products include a full range of thick film hybrid products for the manufacture of ceramic-based circuits, electronic components and high frequency applications such as conductors, resistors, dielectrics, LTCC tape, overglazes and a full range of polymeric products for automotive applications. »More May 5, 2008DuPont will participate in the Symposium on Polymers for Microelectronics The Symposium On Polymers for Microelectronics is one of the foremost comprehensive technical meetings for the integration and processing of polyimides and new polymeric films for advanced microelectronic applications. »More May 2, 2008DuPont to Feature Semiconductor Packaging Offerings at ECTC 2008 DuPont Electronic Technologies will display its expanding portfolio of laminates, thick films, photoresists and removers for semiconductor packaging at the Electronic Components and Technology Conference. »More April 30, 2008 Interra™ Will Co-host Embedded Technology Seminar At the seminar, Dr. Jun Kim, Applications Development Specialist, will present "DuPont Embedded Capacitor Solutions: Driving miniaturization, cost reduction and improved electrical performance in a range of digital and wireless applications." »More April 29, 2008 DuPont™ Interra™ to Participate in PCB East 2008 Dr. Visit DuPont Booth 302 to learn about our Interra™ embedded passive materials for the design of advanced printed circuit boards. »More March 13, 2008 DuPont Technical Paper Wins Award at ECWC 11 in Shanghai Dr. Karl H. Dietz, Technology Manager, DuPont Electronic Technologies presented "Integration of Embedded Capacitors into Flip-chip Substrate Structures for Improved Power System Noise Decoupling and Charge Supply to the IC" at ECWC. »More March 6, 2008 DuPont Printed Circuit Materials Celebrates 40 Years of Innovation with Riston® The newest additions to the portfolio include DuPont™ Riston® LDI7000 Laser Direct Imaging (LDI) dry film photoresist for direct imaging tent-and-etch applications, and DuPont™ Riston® PlateMaster 300 dry film photoresist, designed for fine feature pattern plating. »More March 4, 2008 DuPont Advanced Packaging Lithography Announces Commercial Availability of WBR 2000 Series Films for Advanced Semiconductor Packaging DuPont™ WBR 2000 Series dry film photoresists deliver improved resolution, speed and consistent resist thickness across the wafer, as well as simpler processing and a reduced environmental footprint. »More February 24, 2008 DuPont to Showcase Semiconductor Materials at Semicon China 2008 DuPont will feature its portfolio of innovative materials and process expertise for the semiconductor industry at Semicon China 2008. »More February 19, 2008 DuPont To Present Technical Papers at 2008 IMAPS Device Packaging Conference DuPont Electronic Technologies will once again participate in the IMAPS Device Packaging Conference 2008. The conference provides a focused forum on the latest technological developments related to microelectronics packaging: FlipChip/CSP; 3D Packaging; Optoelectronics; MEMS; and Biomedical. »More January 16, 2008 DuPont to Exhibit at Internepcon 2008 DuPont will feature its flexible printed circuit offering at Internepcon Japan Printed Wiring Board Expo. »More January 2, 2008 DuPont Participated in Advanced Packaging Technology Roadshow in Asia DuPont Advanced Packaging Lithography was part of "Small-Dimensions - Big Results", a tour hosted by SUSS MicroTec to highlight recent developments in MEMS, Advanced Packaging and 3-D Integration. »More		Events
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