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Advanced Semiconductor Packaging & Circuit Materials

Semiconductor Packaging & Circuit Materials

News & Events

July 10, 2012
DuPont Circuit & Packaging Materials Expands Existing Capacity for Kapton® Polyimide Films DuPont announced today that a production expansion project is under way at its DuPont Circleville, Ohio, facility to add up to 400 tons of available production capacity as well as new manufacturing capabilities for its leading DuPont™ Kapton® brand polyimide films. It is anticipated that additional production from this expansion project will begin to become available in fourth quarter of 2012. »More

October 7, 2011
DuPont Microcircuit Materials Presents New Low Temperature Co-fired Ceramic Materials Developments at IMAPS 2011 DuPont™ GreenTape™ 9K5 low temperature co-fired ceramic (LTCC) material with superior dielectric constant properties, is designed for higher speed, higher frequency and higher reliability applications. DuPont also is presenting on methods of characterization for LTCC dielectrics in high frequency microwave and millimeter wave packaging. »More

August 15, 2011
DuPont Microcircuit Materials Advances Printed Electronics Development Efforts by Employing NovaCentrix PulseForge® Tools DuPont Microcircuit Materials (MCM), has announced an arrangement with NovaCentrix regarding MCM’s use of NovaCentrix’s PulseForge® tools which MCM anticipates will further its development of state-of-the-art materials and processing technology, as DuPont continues to expand its portfolio of functional inks for the growing printed electronics industry. »More

February 15, 2011
DuPont Microcircuit Materials Expands Printed Electronics Research with Holst Centre Collaboration The collaboration is expected to advance technology specifically in the area of printed structures on flexible substrates, which has application in flexible display, RFID, lighting, biomedical and Organic Photovoltaic (OPV) markets. »More

December 1, 2010
DuPont Showcases Innovative Offerings for Printed Electronics DuPont Microcircuit Materials (MCM) is highlighting two conductive inks for use in flexographic and gravure processes used to produce printed electronics such as Radio Frequency Identification (RFID) tags, smart packaging, sensors, displays, and solid state lighting. »More

October 12, 2010
DuPont Introduces New Kapton® Films for Flexible and Thin Film Photovoltaic Applications DuPont Circuit & Packaging Materials announces the commercial availability of DuPont™ Kapton® polyimide films engineered for thin film and flexible photovoltaic substrates. DuPont has developed two key products for Amorphous Silicon (a-Si) modules and Copper Indium Gallium Selenide (CIGS) photovoltaic applications. »More

June 7, 2010
DuPont Opens North American Photovoltaic Research Facility DuPont opened a North American photovoltaic applications lab at its Chestnut Run facility in Wilmington to support materials development for the fast-growing photovoltaic solar energy market. »More

May 20, 2010
DuPont Features customizable, functional inks at LOPE-C DuPont Microcircuit Materials will exhibit its broad and growing portfolio of customizable, functional inks for both thin-film photovoltaic and printed electronics at LOPE-C – Organic and Printed Electronics Convention. »More

April 13, 2010
New Silver Conductive Inks Target High-Growth Touch Screen and OLED Markets DuPont Microcircuit Materials (MCM) is expanding its portfolio of silver conductive inks formulated for use in printed electronics, to meet the need for low-cost processing in the high-growth and emerging markets for Touch Screens and devices such as Organic Light Emitting Diodes (OLEDs). »More

March 29, 2010
DuPont Microcircuit Materials Introduces New Screen Printed Ink Materials for Printed Circuit Boards “DuPont CB500 provides the ‘missing link’ in the evolution of selective electroplating that can cut the number of process steps in half,” said Walt Cheng, global business director -- DuPont Microcircuit Materials. »More

March 15, 2010
DuPont Circuit & Packaging Materials Opens New Technical Lab in China This multi-functional lab will enable faster and more efficient technical support for CPM customers in the electronics industry in China, and provide a facility for new product development and process evaluation. » (简体中文)    (繁體中文)

March 4, 2010
DuPont Features New Material Innovations in Electronics at IPC APEX Expo New technologies on display will include dry film photoresists and phototooling films for printed circuit board (PCB) imaging, flexible circuit materials, embedded resistor materials and new screen printed inks for PCB fabrication. »More

February 26, 2010
DuPont Exhibits at CPCA 2010 Shanghai, China DuPont will be featuring its broad offering of technologies for the Printed Circuit Board (PCB) industry at CPCA 2010 in Shanghai, China, March 16 - 18, 2010. »More

May 25, 2009
HD MicroSystems™ Introduces HD-8930 Ultra-Low Cure PBO for Wafer Level Semiconductor Packaging The new offering is the latest in the HD-8900 low-cure PBO series and combines the proven reliability of HD MicroSystems’ PBO technology with curing temperatures as low as 200°C.  With its low modulus and high elongation, HD-8930 achieves superior drop test results, making it ideal for use in portable electronic devices. » More

March 2, 2009
DuPont highlights Wafer Level Packaging Solutions at IMAPS Device Packaging 2009 Conference DuPont will feature new ultra-low cure dielectric materials for WLP and 3D/TSV applications, and spotlight advanced material sets and process technologies for Fan Out, 3D/TSV, RDL, Bonding and Bumping applications. »More

January 29, 2009
DuPont Wafer Level Packaging Solutions, Nippon Kayaku and MicroChem Sign Joint Development Agreement Joint Development Agreement to develop new advanced photodefinable epoxy based materials directed to emerging WLP and 3D/Through-Silicon Via (TSV) applications. »More

November 19, 2008
DuPont Microcircuit Materials Introduces New Offering for Printed Electronics Silver Conductive Ink Designed as Cost-Effective Solution for RFID Antennae, Biosensors, Membrane Touch Switch Applications and More. »More

October 23, 2008
DuPont to Participate in Technical Sessions at Taiwan Printed Circuit Association (TPCA) Learn about DuPont products such as Riston® dry film photoresists, Kapton® polyimide film, Coolam™ parts, Pyralux® polyimide laminate, and Ultimax™ for printed circuit board manufacture. »More

September 23, 2008
DuPont Electronic Technologies Expands Wafer Level Packaging Solutions DuPont Electronic Technologies has announced a new expansion focused on material solutions for wafer level packaging (WLP) and emerging three dimensional (3D) and Through Silicon Via (TSV) semiconductor packaging applications »More

September 9, 2008
DuPont Microcircuit Materials Features Enabling Technologies at the FISITA World Automotive Conference DuPont Microcircuit Materials (MCM), part of DuPont Electronic Technologies, will exhibit the latest innovations in automotive electronic ceramic circuits using DuPont thick film compositions at the FISITA World Automotive Conference. »Deutsch

July 11, 2008
DuPont EKC Technology Introduces New EKC162™ Photoresist Remover for Advanced Semiconductor Packaging EKC Technology will introduce a new photoresist remover for Through Silicon Via (TSV) and Wafer Level Packaging (WLP) for copper pillar and solder bump applications at SEMICON West. »More

June 23, 2008
DuPont to Feature Semiconductor Materials at SEMICON West 2008 DuPont will exhibit its portfolio of advanced material technologies for semiconductor fabrication and packaging at SEMICON West in San Francisco, July 15-17, 2008. »More

June 11, 2008
DuPont Electronic Technologies Announces Global Price Increase DuPont Electronic Technologies cites rising raw material, transportation and energy costs among its reasons for the increase. »More

May 27, 2008
DuPont Microcircuit Materials Showcases full range of Innovative Materials for Automotive Electronics at SMT 2008 Products include a full range of thick film hybrid products for the manufacture of ceramic-based circuits, electronic components and high frequency applications such as conductors, resistors, dielectrics, LTCC tape, overglazes and a full range of polymeric products for automotive applications. »More

May 5, 2008
DuPont will participate in the Symposium on Polymers for Microelectronics The Symposium On Polymers for Microelectronics is one of the foremost comprehensive technical meetings for the integration and processing of polyimides and new polymeric films for advanced microelectronic applications. »More

May 2, 2008 
 DuPont to Feature Semiconductor Packaging Offerings at ECTC 2008 DuPont Electronic Technologies will display its expanding portfolio of laminates, thick films, photoresists and removers for semiconductor packaging at the Electronic Components and Technology Conference. »More

March 13, 2008  DuPont Technical Paper Wins Award at ECWC 11 in Shanghai Dr. Karl H. Dietz, Technology Manager, DuPont Electronic Technologies presented "Integration of Embedded Capacitors into Flip-chip Substrate Structures for Improved Power System Noise Decoupling and Charge Supply to the IC" at ECWC.   »More

 

March 6, 2008  DuPont Printed Circuit Materials Celebrates 40 Years of Innovation with Riston® The newest additions to the portfolio include DuPont™ Riston® LDI7000 Laser Direct Imaging (LDI) dry film photoresist for direct imaging tent-and-etch applications, and DuPont™ Riston® PlateMaster 300 dry film photoresist, designed for fine feature pattern plating.   »More

 

March 4, 2008  DuPont Advanced Packaging Lithography Announces Commercial Availability of WBR 2000 Series Films for Advanced Semiconductor Packaging DuPont™ WBR 2000 Series dry film photoresists deliver improved resolution, speed and consistent resist thickness across the wafer, as well as simpler processing and a reduced environmental footprint.   »More

 

February 24, 2008  DuPont to Showcase Semiconductor Materials at Semicon China 2008 DuPont will feature its portfolio of innovative materials and process expertise for the semiconductor industry at Semicon China 2008.   »More

 

February 19, 2008  DuPont To Present Technical Papers at 2008 IMAPS Device Packaging Conference DuPont Electronic Technologies will once again participate in the IMAPS Device Packaging Conference 2008. The conference provides a focused forum on the latest technological developments related to microelectronics packaging: FlipChip/CSP; 3D Packaging; Optoelectronics; MEMS; and Biomedical.   »More

 

January 16, 2008  DuPont to Exhibit at Internepcon 2008 DuPont will feature its flexible printed circuit offering at Internepcon Japan Printed Wiring Board Expo.   »More

 

January 2, 2008  DuPont Participated in Advanced Packaging Technology Roadshow in Asia DuPont Advanced Packaging Lithography was part of "Small-Dimensions - Big Results", a tour hosted by SUSS MicroTec to highlight recent developments in MEMS, Advanced Packaging and 3-D Integration.   »More