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Advanced Semiconductor Packaging & Circuit Materials

Semiconductor Packaging & Circuit Materials

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News Archive - 2005

November 11, 2005 DuPont-Toray Co., LTD Increases Capacity for DuPont™ Kapton® Polyimide Film DuPont Electronic Technologies today announced plans to expand the production of DuPont™ Kapton® polyimide film with Du Pont–Toray Co., LTD, its joint venture with Toray Industries, Japan. Approximately $95 million will be invested in the new facility, which is expected to increase overall capacity for DuPont™ Kapton® by approximately 25 percent to serve the continued rapid growth of the flexible circuit industry.   »More

November 11, 2005 MEPTEC Article: DuPont Semiconductor Packaging & Circuit Materials – Connected by Science Drawing on the company’s broad science capabilities and long established positions in both semiconductor fabrication and circuit materials, DuPont Semiconductor Packaging and Circuit Materials (DSPCM) is taking a unique approach, and developing a portfolio of new processing and permanent materials for producing high reliability chip scale, flip chip, and wafer level packages and MEMS.   »More

September 26, 2005 DuPont Paves the Way to Lead-Free with New System LF Thick Film Compositions System LF addresses the increasing market demand for a lead-free thick film system offering for the production of cross over and multilayer ceramic assemblies. The LF series includes gold, silver, palladium/silver, and platinum/silver conductors, dielectrics, via-fills, and overglaze materials.   »More

August 30, 2005 Connected by Science: DuPont Semiconductor Materials A team comprised of more than 10 DuPont business units, including: DuPont Electronic Technologies, DuPont Fluoroproducts, DuPont Engineering Polymers, and DuPont Performance Elastomers recently united as "One DuPont" to exhibit its range of semiconductor materials at Semicon West in San Francisco, California.   »More

July 22, 2005 DuPont Electronic Technologies and Sanmina-SCI Sign Licensing Agreement for DuPont™ Interra™ Embedded Passive Materials Use in Buried Capacitance® Technology DuPont™ Interra™ HK polyimide laminates can now be used in the practice of Buried Capacitance® technology, available to Sanmina-SCI's existing family of licensed printed circuit board (PCB) manufacturers.   »More

July 12, 2005 DuPont Advanced Packaging Lithography Introduces Microlithographic Polymer Films, Appoints MicroChem as New Distributor One year to the month after Spirit and Opportunity landed on Mars, the Rovers are still roaming the planet, sending back crystal-clear images of the Martian surface.   »More

June 14, 2005 DuPont Microcircuit Materials Highlights 943 Low Loss Green Tape™ Material System at IEEE MTT-S International Microwave Symposium DuPont Microcircuit Materials (MCM) today announced the introduction of two new DuPont™ Green Tape™ low temperature, co-fired ceramic (LTCC) material systems - 943 KX and 943 PX - for low loss, high frequency applications.   »More

January 21, 2005 DuPont Electronic Materials Keep Mars Rovers Going One year to the month after Spirit and Opportunity landed on Mars, the Rovers are still roaming the planet, sending back crystal-clear images of the Martian surface.   »More

September 9, 2004 DuPont Electronic Technologies and Samsung Cheil Industries, Inc. Announce Joint Venture Agreement for Flexible Circuit Materials DuPont Electronic Technologies and Cheil Industries, Inc., part of the Samsung Group, have signed a 50/50 joint venture agreement, pending local and government approvals, to establish SD Flex Company, LLC.   »More