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Advanced Semiconductor Packaging & Circuit Materials

Semiconductor Packaging & Circuit Materials

2006 News Archive

December 11, 2006 AWR® and DuPont Microcircuit Materials Deliver LTCC PDK for Microwave Office Design Suite Applied Wave Research, Inc. (AWR®) and DuPont Microcircuit Materials, part of DuPont Electronic Technologies, today announced the availability of a process design kit (PDK) that enables radio-frequency (RF), microwave, and millimeter wave designers to access the DuPont™GreenTape™ low temperature co-fired ceramic (LTCC) technology within AWR's Microwave Office® 2006 software.  »More

November 20, 2006 DuPont Microcircuit Materials Celebrates 10 Year Anniversary at EMDD, Dongguan, China DuPont was the first multinational company to establish a production facility for thick film microcircuit materials in China. Since its start-up in 1996, EMDD has been serving the rapidly growing China domestic electronics market.   »More

October 11, 2006 DuPont Electronic Technologies Signs Joint Development Agreement with Taiyo Ink DuPont Electronic Technologies today announced it has signed a joint development agreement (JDA) with Taiyo Ink Manufacturing Company, Ltd. to advance the development of buildup microvia dry films for use in advanced flip chip ball grid array packages for the semiconductor industry.   »More

October 5, 2006 DuPont Microcircuit Materials Scientist Honored at IMAPS DuPont Microcircuit Materials (MCM), part of DuPont Electronic Technologies, today announced that Senior Scientist Roupen Keusseyan will be presented with the William D. Ashman Award by the International Microelectronics and Packaging Society (IMAPS).   »More

September 13, 2006 DuPont Showcases a New Thermal Laminate at IMAPS LED Workshop During the workshop, DuPont introduced a new thermal laminate based on exciting, new polyimide film technology.   »More

July 24, 2006 DuPont Opens Semiconductor Materials Technical Center in Taiwan As part of its strategic plan for long term growth in the semiconductor materials market, DuPont Electronic Technologies has established a Semiconductor Materials Technical Center in Taiwan’s Hsinchu Science Park.   »More

June 15, 2006 DuPont Showcases Semiconductor Fabrication & Packaging Materials at SEMICON West 2006 DuPont today announced it will showcase its expanding portfolio of semiconductor fabrication and advanced packaging materials at SEMICON West 2006 at the Moscone Center in San Francisco, Calif., July 11 - 13. By connecting science and technology from across the company, DuPont has established a leading position in the industry with highly engineered materials and advanced process expertise.   »More

April 2, 2006 DuPont Advanced Packaging Lithography Appointed As U.S. Representative for Microcontrol Electronic Equipment DuPont Advanced Packaging Lithography, part of DuPont Electronic Technologies, announced it has been appointed the U.S. sales representative for Microcontrol Electronic’s line of Leonardo® tape laminator systems.   »More

March 31, 2006 DuPont Semiconductor Packaging & Circuit Materials Appoints Fraunhofer IZM as Key Partner in Applications Development DuPont Semiconductor Packaging & Circuit Materials today announced an applications development agreement with the Fraunhofer Institute for Reliability and Microintegration IZM, one of the leading experts for microelectronics and microsystems packaging worldwide.   »More

March 27, 2006 DuPont Printed Circuit Materials and Agfa Specialty Products Announce Asian Distribution Agreement for New Idealine™ Phototooling Films DuPont will distribute the new Agfa Idealine™ brand silver halide phototooling films and chemicals to Printed Wiring Board (PWB) fabricators in the Americas, and throughout most of Asia.   »More