2007 News Archive

DuPont featured its expanding portfolio of advanced packaging materials at SEMICON Europa 2007. This year's show was held at the Stuttgart Trade Fair Center in Stuttgart, Germany on October 9-11, 2007.   »More

DuPont will showcase its expanding portfolio of semiconductor fabrication and advanced packaging materials at Semicon Taiwan 2007.   »More

This workshop will feature the latest papers on integrating resistors, capacitors, and inductors into leading edge applications. and will focus on all aspects of passive integration.   »More

DuPont Electronic Technologies today announced that the company has joined IMEC as an Industrial Affiliate in 45nm and 32 nm technology development programs on cleaning, contamination control and advanced interconnects.   »More

DuPont Semiconductor Fabrication and Packaging Materials has announced it will host a technical panel discussion, "Technology Partnerships & Tools for the Future", featuring experts from leading companies including Intel, Spansion, Applied Materials, ASML, Brewer Science, SEMATECH and the University of Arizona's Center for Environmentally Benign Semiconductor Manufacturing.   »More

DuPont Electronic Technologies is pleased to announce that we will once again be participating in the Device Packaging Conference 2007. At this year’s conference, we will spotlight our thin and thick film offerings for wafer level packaging, WLP photoresist removers from EKC Technology, and Interra™ embedded passive materials.   »More

DuPont Electronic Technologies (ET) in Research Triangle Park, NC recently hosted The International Wireless Industry Consortium, as part of an interactive technical workshop on handset technologies for multi-mode, multi-band cell phone antenna designs, sponsored by Sony Ericsson.   »More

DuPont showcased its expanding portfolio of materials for Semiconductor Packaging and Circuit Materials at InterNepcon Japan 2007.   »More