Dielectrics, Conductors & Resistors

Crossover and Multilayer Dielectrics

Thick film hybrid circuit technology constantly is being stressed due to the handling of the high power dissipation and performance in high temperature environments with cycling between temperature extremes. DuPont dielectrics provide excellent insulation at reduced thickness with mechanical robustness to support soldered devices. Dielectrics deliver reliability in harsh environments and enable the use of inner-layer silver conductors to improve cost effectiveness, multi-layer circuits, and cross-over designs. Many DuPont dielectrics for crossover and multi-layers can be fired using short firing cycles (below 30 minutes) without affecting their performance. Environmentally friendly dielectrics (with PbO contents below 1%) are available to meet the stringent specifications on the use of the restricted materials.

For application onto ceramic substrates and dielectric layers by screen printing. Single- and multi-layer circuits made with silver and gold bearing conductors also use gold pads as bond areas to interconnect bare interconnectors using chip and wire techniques.

DuPont™ Fodel® photo patterned materials

DuPont photo patterning with thick film process allows for the formation of fine line features with excellent edge definition. More and more applications are demanding increased functionality in smaller packages and the DuPont™ Fodel® system of photoprintable products significantly increases the density in the X Y plane with no yield penalty. Using Fodel® materials and processes, the system delivers fine lines in condense conductor traces with 50 micron lines on a 100 micron pitch and spaces on conventional alumina substrate. Thick Film conductors and DuPont™ QG150 can be patterned to 25 micron lines and spaces using etching.

Thick Film Resistor Compositions

To meet the needs of an increasingly demanding hybrid circuit market, DuPont introduced a new high performance resistor series. By understanding the complex chemical, physical and electrical interactions between constituents of a thick film resistor and multilayer dielectrics, we have designed a resistor system with improved TCR control, a wide process window, minimum and controlled termination effects and excellent environmental stability. Additional benefits provided by the DuPont resistors are low noise characteristics (rated up to five times better than those of conventional systems), improved post-laser trim stability (improved by a factor of three), and outstanding durability at high temperatures. The 20 µm dry print thickness results in reduced material consumption and faster trimming in the production process.

Thick Film Brazing System

The demands for placing more functionality into smaller packages creates numerous EMI/RFI issues. DuPont thick film brazing mateirals forms a EMI/RFI shielding and hermetic package. Our high strength, high reliability attachment mechanism is compatible with thick film resistors, as well as conventional IC and LID attach processes.

Via Fill Conductive Paste

We provide conductive pastes utilized to form an interconnection between a thick film hybrid circuit.