Advanced Packaging Lithography
Dry Film Photoresists
A new family of permanent and non-permanent photopolymer films designed for wafer applications in advanced semiconductor packaging, including wafer bumping for flip chip, backside wafer coating and other wafer level packaging applications. Our broad DuPont™ WB Series of thick (50-120um) dry film photoresists for wafer bumping excel in both photo stencil and electroplating processes. Significant benefits versus liquid resists include higher yield and quality through uniform resist thickness across the wafer, higher productivity without need for drying or double coating, and environmental benefits from reduced material wastage and a solvent free process.
DuPont™ Riston® Dry Film Photoresist
New DuPont™ Riston® dry film photoresists are continuously developed for leading edge patterning of organic substrates for advanced packaging.
Permanent Dielectrics
Liquid Polyimides
We have the broadest portfolio of liquid polyimides in the industry. Our materials are proven as stress buffers, and because of superior mechanical and thermal properties, are now being favored for advanced packaging. High temperature, photosensitive HD-4000 is used for wafer level bumping, C-4 and redistribution. Low modulus HD-7000 is used for compliant and gap filling applications, such as SIP. Our new low temperature cure (225°C) polyimides enable low thermal budget memory technologies. Low stress polyimides are used for 300mm wafers and multilayer applications.
GreenTape™ Low Temperature Co-fired Ceramics (LTCC)
The long-term reliability of semiconductors is affected by the properties of materials used in the packaging. Issues related to semiconductor packaging include moisture absorption and moisture intrusion in polymer packages and die attach materials. LTCC acts as a superior hermetic packaging technology versus organic materials for applications that have demanding thermal requirements, very high circuit density needs through fine features and component integration, and need to be able to resist harsh environments.
DuPont™ Interra™ embedded passives
Through our unique technology which marries the performance of fired ceramics with low cost printed circuit board manufacturing, discrete capacitors with capacitance densities of 150nF/sq. cm can be embedded in packages for decoupling applications.
DuPont™ Teflon® AF fluoropolymer
Teflon® AF is a family of amorphous fluoropolymers. These materials are comparable to other fluoropolymers in their performance over a wide range of temperatures, in having excellent chemical resistance, and in having outstanding electrical properties. The Teflon® AF polymers are distinct from other fluoropolymers in that they are soluble in selected solvents, have high gas permeability, high compressibility, high creep resistance, and low thermal conductivity. Teflon® AF polymers have the lowest dielectric constant of any known solid polymer. Teflon® AF polymers have the lowest index of refraction of any known polymer.
Laminate Materials
Microlux® polyimide
DuPont™ Microlux® all polyimide laminates offer exceptional reliability such as peel strength in stressful environments and can be used for folded and stacked chip scale packages. These laminates will be commercially available and in roll format by mid 2006.
DuPont™ Kapton® polyimide film
High modulus Kapton® E polyimide film is used in sputter plated laminates for fine pitch packages produced via TAB processing.
