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Advanced Semiconductor Packaging & Circuit Materials

Semiconductor Packaging & Circuit Materials

Products & Services

DuPont offers a growing portfolio of semiconductor packaging and circuit materials enabling the manufacture of different interconnects spanning printed circuits boards, flexible circuits and thick film hybrids, to semiconductor packages, modules and MEMS. No matter what challenge you face, let us help you solve them. Explore our innovative solutions below.

Printed Circuit Boards

DuPont™ Riston® dry film photoresists, DuPont™ ImageMaster™ phototooling films, and imaging process technologies are widely used in the manufacture of leading edge printed circuit boards.

 

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Flexible/Rigid-Flex Circuits

DuPont™ Pyralux® and Kapton® materials have been the foundation of the flex circuit industry for decades and comprise a broad offering of materials for a variety of applications. 

 

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Advanced Semiconductor Packages

Dielectrics, patterning resists and laminates for wafer level, chip scale and flip chip packages.

 

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Wafer Level Packaging

New products provide a step change in precise bump formation and clean resist removal to meet the most challenging wafer level and flip chip bumping requirements.

 

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Thick Film Hybrids

A complete line of thick film paste solutions for the microelectronics market for complex active and discrete packages.

 

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Modules

Cost effective solutions for modules utilizing ceramic and organic technologies.

 

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Micro Electro Mechanical Systems (MEMS)

Permanent and non permanent polymer film and ceramic technology for structuring and packaging hermetic MEMS and MST devices.

 

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