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Advanced Semiconductor Packaging & Circuit Materials

Semiconductor Packaging & Circuit Materials

Micro Electro Mechanical Systems (MEMS)

DuPont R&D and engineering resources continue to provide innovative ceramic and organic technologies to meet the growing demands of Micro Electro Mechanical Systems (MEMS) and Micro Systems Technology (MST) including: precise fine structures, hermetic, chemical resistance, and thermal management applications.

Ceramic Technologies


DuPont™ GreenTape™ System

Look to DuPont LTCC for next generation packaging that requires an improved level of mechanical, thermal, and evironmental stability combined with increased capability to integrate electrical and optical functions.


DuPont™ Fodel™ materials

DuPont photo patterning with thick film or LTCC process allows for the formation of fine line features with excellent edge definition. Using Fodel™ materials and processes, the system delivers fine lines in condense conductor traces with 50 micron lines on a 100 micron pitch and spaces on either conventional alumina substrate or LTCC multilayer.

 

Organic Technologies


MX Series Dry Film Photoresists

Permanent or non permanent materials are available in a wide range of precisely controlled thicknesses (15-100µm). MX Series™ products deliver capability to bridge trenches for structuring of MEMS devices, using a variety of plating chemistries, wet or dry etching.



Liquid Polyimides

Liquid polyimides are being utilized in various MEMs applications.  Polyimides have been successfully used as sacrificial layers, flexible membranes and dielectric layers in MEMS devices. Whether you require a polyimide that has a low CTE of 3ppm/C (PI–2600), a thick film compliant polyimide (HD-7000), or a low  < 250C cure polyimide (HD–8800), we offer the broadest portfolio of liquid polyimides to meet your unique MEMS needs.