Hermetic multichip modules are currently the standard method for packaging Integrated Circuits (IC's) requiring high reliability and performance. The need for hermetic packaging is becoming even more critical with increased circuit density and closer packing of bare IC's. DuPont is working with key OEM design engineers to understand the importance of materials in the designing of a robust module. We currently offer ceramic and organic material technologies to allow for the integration of active and passive components in packages for automotive, computer, commercial, telecommunications and military applications. Our technologies can provide tremendous benefits in terms of high performance and small size without sacrificing the high performance you might need.