Ceramic Technologies

DuPont™ Green Tape™ System

DuPont™ Green Tape™ Low Temperature Co-fired Ceramic (LTCC) system meets the need for flip chip compatibility, small size, and robust high frequency and mechanical properties.

By using DuPont™ Green Tape™ system, customers are able to integrate microwave structures for the antenna filter and transmit/receive baluns into the substrates, providing good performance and a well-balanced utilization of the top and inner layers of the substrate. The modules also have a small form factor as a result of the flip chip assembly of the IC to the LTCC substrate, and BGA assembly to the application PCB.

Thick Film Hybrids

The need for hermetic packaging is becoming even more critical with increased circuit density and closer packing of bare IC's. This is applicable to all types of multichip modules (D, C or L), independent of the metallization scheme used. Look to DuPont thick film multilayer material system for producing integrated low cost hermetic multichip hybrid modules for high performance applications requiring low resistivity metallizations, large number of input/output and high thermal conductivity.

The DuPont material system consists of a hermetic thick film dielectric composition, gold and silver based thick film metallization compositions and a gold and silver based thick film barrier composition for metallization of brazing pads. Integrated hermetic multichip modules are produced by brazing directly (to the barrier thick film) pins and leads for input/output, window frames for hermeticity, and heatsinks for high thermal conductivity applications.

DuPont™ Fodel™ materials

Finer lines and improved line definition is needed for applications requiring high density and especially for microwave applications. Fodel® is the key technology that would allow standard ICs or available ASICs to be combined with memory chips to form high-value, application-specific modules with the same "footprint" as a single packaged chip. This level of integration was made possible because Fodel® conductors can resolve 50 micron lines and spaces, and Fodel® dielectrics can form 75 micron vias on a 150 micron pitch, thus allowing two or more ICs to be integrated into a small-footprint, high-performance package. The completed substrate, containing several chips, can be made available in standard formats to facilitate easy handling and assembly. By placing processors and memory modules close together on the same substrate, performance can also be improved.

Organic Technologies

DuPont™ Interra™ ceramic capacitor

Interra™ ceramic thick film capacitor is a novel technology used for decoupling applications.  The module segment is naturally positioned to take advantage of the high capacitance density provided by the Interra™ ceramic thick film. Utilizing DuPont expertise in the ceramic thick film technology, the Interra™ ceramic capacitor is able to achieve a Dk > 3000 and a capacitance density of > 150 nF/sq cm.  These attributes allow DuPont embedded capacitor technology to enable OEMs and fabricators to realize not only performance gains but also cost saving benefits.

DuPont™ Interra™ polymer resistor

Size reduction, cost savings, and improved reliability are key benefits that sets the Interra polymer thick film resistor apart from its competitors.  Using Interra™ embedded resistor technology, a majority of resistors on a module were embedded allowing for a size reduction of more than 25%. The Interra™ polymer resistor technology is truly groundbreaking since it eliminates the need for silver terminations thus reducing a large cost component and improving reliability.  The need of the PWB industry requiring a high reliability, low cost embedded resistor has finally been met.

Liquid Polyimides

We have the broadest portfolio of liquid polyimides in the industry. Our materials are proven as traditional stress buffers and because of superior mechanical and thermal properties are now being favored for newer flip chip packages. High temperature, photosensitive HD-4000 is used for wafer level bumping, C-4 and redistribution. Low  modulus HD-7000 can be coated as thick films (20-70um) making it ideal for compliant and gap filling applications, such as SIP modules.

DuPont Microlux polyimide laminate

Microlux® all polyimide laminates offer exceptional reliability such as peel strength in stressful environments and can be used for used for folded multi-chip and stacked chip scale packages. These laminates will be commercially available and in roll format by mid 2006.

DuPont™ Riston® Dry Film Photoresist

New DuPont™ Riston® dry film photoresists are continuously developed for leading edge patterning of organic substrates for advanced packaging and modules.

Microlithographic Polymer Films (MPF)

A new family of permanent and non-permanent photopolymer films designed for imaging on inorganic substrates and wafer applications in advanced semiconductor packaging and modules. Applications include patterning using various plating processes, wet and dry etching, wafer bumping, bonding of substrates, permanent housing and protective coatings.