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Advanced Semiconductor Packaging & Circuit Materials

Semiconductor Packaging & Circuit Materials

Science of Semiconductor Packaging & Circuit Materials

DuPont is a science company with broad technology competence spanning polymers, fibers, photopolymers, ceramics, dispersions, coatings and film making. We are putting our science to work in a broad and growing portfolio of innovative materials technologies for both ("first level") semiconductor packaging applications and traditional ("second level") circuit applications such as printed circuit boards, flex/rigid-flex circuit and ceramic thick film hybrids.

These are four basic Semiconductor Packaging & Circuit fabrication technologies, each of which is based on unique manufacturing infrastructure and materials sets:

  1. Rigid organic printed circuit processes used to manufacture printed circuit boards, semiconductor packages (eg. Ball Grid Arrays) and modules
  2. Flexible organic printed circuit processes used to manufacture flex/rigid-flex circuits and semiconductor packages (eg. chip scale packages)
  3. Ceramic circuit processes such as thick film used to manufacture hybrids and low temperature co-fired ceramic (LTCC) used to manufacture modules
  4. Wafer based processes such as bumping and redistribution for flip chip and wafer level semiconductor packages and others (eg. etching) for specialty applications such as MEMS, and CMOS camera sensors.