DuPont is a science company with broad technology competence spanning polymers, fibers, photopolymers, ceramics, dispersions, coatings and film making. We are putting our science to work in a broad and growing portfolio of innovative materials technologies for both ("first level") semiconductor packaging applications and traditional ("second level") circuit applications such as printed circuit boards, flex/rigid-flex circuit and ceramic thick film hybrids.
These are four basic Semiconductor Packaging & Circuit fabrication technologies, each of which is based on unique manufacturing infrastructure and materials sets:
- Rigid organic printed circuit processes used to manufacture printed circuit boards, semiconductor packages (eg. Ball Grid Arrays) and modules
- Flexible organic printed circuit processes used to manufacture flex/rigid-flex circuits and semiconductor packages (eg. chip scale packages)
- Ceramic circuit processes such as thick film used to manufacture hybrids and low temperature co-fired ceramic (LTCC) used to manufacture modules
- Wafer based processes such as bumping and redistribution for flip chip and wafer level semiconductor packages and others (eg. etching) for specialty applications such as MEMS, and CMOS camera sensors.
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