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Advanced Semiconductor Packaging & Circuit Materials

Science of Semiconductor Packaging & Circuit Materials

Rigid Printed Circuit Technology

This is by far the most prevalent technology and accounts for >60% of all packages and circuits made. DuPont revolutionized the way circuits were manufactured in 1968 through the introduction of our DuPont™ Riston® dry film photoresist technology. This remains to be the preferred imaging process.

DuPont has continued to advance etching and plating fine line circuitry by focusing both on dry film functionality and innovative processing.

Imaging materials such as photoresists and ancillary phototooling films will continue to be at the core of our offering for this fabricator group. However, DuPont has begun to extend its focus toward permanent materials such as low loss laminate materials, build up microvia dielectrics, embedded passives and next generation patterning technologies. These materials technologies are relevant for newer, higher density and more demanding electrical applications like packages and modules.

DuPont is investing significant R&D effort towards developing a complete portfolio of DuPont™ Interra™ embedded passive materials which will be incorporated in the printed circuit manufacturing process. Our Interra™ HK laminates which are used as planar capacitance layers are based on marrying our expertise in thin, high reliability polyimides, ceramics and dispersions.