Selection of the correct back-side paste is complicated by the front-side silver paste, since the two are co-fired. DuPont Technical Service should be consulted to develop optimum firing conditions.
Back-side Conductor Requirements:
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Good Back Surface Field (BSF) Aluminum helps penetrate the native oxide layer on the wafer, generating better contact to the silicon.
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Low BowEnables the reduction of the silicon thickness, thereby reducing cost.
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High Speed PrintingFor modern, high volume production lines.
DuPont Paste Offerings:
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Solamet® PV333 Al (Cd-free)Is the standard aluminum paste
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Solamet® PV322 Al (Cd-free & Pb-free)First generation low bow product
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Solamet® PV341 Al (Cd-free & Pb-free)Second generation very low bow for use on wafers < 240 microns thick
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Solamet® PV202 Ag/Al (Cd-free)Is the standard Ag/Al paste.
For more information on Solamet® or other DuPont Photovoltaic Solutions, please contact your local representative.
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