c-Si Cells - Standard Cell Architecture
DuPont™ Solamet® N-type silver/aluminum frontside metallization pastes

DuPont™ Solamet® PV3Nx new generation silver/aluminum paste for p-type emitters, introduces Solamet® PV3N2 metallization which provides 30-40% better contact resistivity on B-doped emitters compared to Solamet® PV3N1.

DuPont™ Solamet® PV3N2 features include:

  • Fine line printability (for gridlines with screen printing)
  • Fire-through passivation layer
  • Low contact resistivity on B-doped emitter layer
  • Low gridline resistivity (high conductivity)
  • Co-fireable with rear side contacts
  • Good solderability and adhesion
  • Cadmium free*

* Cadmium free as used herein means that Cadmium is not intentionally added to the referenced product. Trace amounts however may be present.

Please contact us for more information on Solamet® PV metallization pastes or other DuPont Photovoltaic Solutions.