WILMINGTON, Delaware, October 3, 2007
New DuPont™ Zenite® LCP Meets Warpage Challenge of Thinner Electronic Parts
A new grade of DuPont™ Zenite® LCP liquid crystal polymer meets needs for ultra-low warpage in the thinner part designs used in ever smaller electronic devices. Typical applications for new Zenite® ZE55201 include electronic connectors, chip sockets and interposers.
“Standard resins that perform perfectly well in thicker parts can produce unacceptable warpage in the emerging generation of low-profile designs,” said Bill Hassink, senior market development specialist for DuPont Engineering Polymers. “New Zenite® ZE55201 has shown that it can meet the challenge in molding trials and early production experience.”
The new resin’s ultra-low-warp performance is achieved by reducing anisotropic shrinkage. Its flow direction shrinkage is similar to that of a typical 30 percent glass-reinforced LCP, but its cross-flow shrinkage is more than 50 percent lower.
The new grade, Zenite® ZE55201 BK010, is reinforced with 50 percent glass and mineral and is available only in black. Mechanical properties and flow are in the same range as other highly filled LCP grades. A properties data sheet is available at: http://plastics.dupont.com/plastics/dsheets/zenite/ZENITEZE55201BK010.pdf
DuPont is a science-based products and services company. Founded in 1802, DuPont puts science to work by creating sustainable solutions essential to a better, safer, healthier life for people everywhere. Operating in more than 70 countries, DuPont offers a wide range of innovative products and services for markets including agriculture and food; building and construction; communications; and transportation.
# # #