Research Triangle Park, NC, April 7, 2010
DuPont Introduces Pyralux® TK Flexible Circuit Materials for High Speed and High Frequency Printed Circuit Boards
Combines DuPont™ Teflon® and Kapton® to Boost High Speed Performance
(High resolution image) Pyralux® TK flexible circuit materials used in flex interconnect applications provide exceptionally high speed electrical performance.
DuPont Circuit & Packaging Materials (CPM) introduced its newest high-performance laminate for printed circuit boards. DuPont™ Pyralux® TK flexible circuit material is a copper clad laminate and bonding film system specifically formulated with DuPont™ Teflon® fluoropolymer film and Kapton® polyimide film for high speed digital and high frequency flexible circuit applications. DuPont™ Pyralux® TK delivers the lowest dielectric constant (DK)
of any thin laminate and bondply material on the market today.
“Our ability to combine DuPont™ Teflon® and Kapton® technologies in Pyralux® TK has resulted in a product that is uniquely suited to high speed flexible circuit designs,” said Thomas D. Lantzer -- market segment leader, High Reliability & Telecom, DuPont Circuit & Packaging Materials. “There is no glass in the construction of Pyralux® TK, so it’s ideal for flexible applications. Its combination of low dielectric constant, low loss tangent, low moisture tolerance and tight thickness tolerance are unparalleled in the industry today. DuPont continues to put science to work to expand its offerings, and we’re very pleased to add this to our Pyralux® portfolio to meet our customers’ needs for advanced high performance and high speed designs.”
With a dielectric constant (DK) of 2.3 to 2.7, and low loss dissipation factor (DF) of 0.002 or 0.003 depending on the film construction, Pyralux® TK is designed for high speed flex applications, including microstrip and stripline controlled impedance constructions. The clad dielectric is a proprietary layered composite of Teflon® and Kapton® films. A variety of copper foil weights are available; the standard foils are 18 and 35 micron rolled annealed (RA) copper. Pyralux® TK bonding film is also a layered dielectric, made with Teflon® and Kapton® films. The bonding film contains a Teflon® film with a lower lamination temperature than the clad. The Teflon® in the bonding film is also available separately as a sheet adhesive. Thin (2 to 4 mil) DuPont™ Pyrlaux® TK is available in laminate thicknesses of 50, 75 and 100 microns. Bondply thicknesses are available in 75 or 100 microns. DuPont also plans to offer a Pyralux® TK sheet adhesive in 12, 25, and 50 microns.
By connecting science and technology from across the company and around the world, DuPont continues to deliver advanced material solutions for the PCB industry. DuPont™ Pyralux® TK will be featured as part of a broad and growing portfolio of innovations in circuit materials at the IPC APEX Conference & Exhibition at Mandalay Bay in Las Vegas, Nev., from April 6 – 8, 2010. Other new technologies on display will include Riston® dry film photoresists and Idealine™ phototooling films for PCB imaging, additional Pyralux® flexible laminate materials and embedded resistor materials for PCB fabrication, and new CB Series screen printed ink materials. To learn more about the products DuPont will be featuring for the PCB industry at the IPC APEX Expo this year, please visit us at the show in booth #616, or visit http://electronics.dupont.com/ipc for further details.
DuPont is a science-based products and services company. Founded in 1802, DuPont puts science to work by creating sustainable solutions essential to a better, safer, healthier life for people everywhere. Operating in more than 70 countries, DuPont offers a wide range of innovative products and services for markets including agriculture and food; building and construction; communications; and transportation.