DuPont highlighted its latest electronic material innovations at DesignCon 2011 Conference & Exhibition, including its broad and growing portfolio of leading Pyralux® brand flexible circuit materials that offer a new range of options for high reliability designs. The new Pyralux® TK and the expanded Pyralux® AP, AP-PLUS and APR family of materials were featured, along with Interra™ HK04 embedded passive materials.
In addition, DuPont presented a technical paper:
Characterization of Flexible Circuit Dielectrics for High Speed Applications Presented by Glenn Oliver, DuPont Electronics & Communications
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Abstract
Designing flexible circuits for maximum signal integrity is often challenging since data for polyimide-based dielectrics are not as well characterized at high frequencies as well as better known low-loss materials. Data is presented and characterized for commonly used flexible circuit polyimide-based dielectrics and low-loss rigid dielectrics. Both in-plane (x-y) and out-of-plane (z) components of relative permittivity (dielectric constant) and loss tangent are measured using separate test fixtures and methods. Data is collected between 2 GHz and 25 GHz. By using different methods on the same samples, isotropy differences of dielectric constant and loss tangent can be determined for both polyimide-based flexible materials and glass reinforced low loss rigid laminates.
