August 5, 2013DuPont Circuit & Packaging Materials and IQLP Ink Deal to Develop High-Speed Circuit Technology
DuPont and IQLP, LLC, a division of Interplex Industries, Inc., today announced their ongoing efforts to further develop and refine liquid crystal polymer (LCP) thin-film technology for use in high-speed circuit applications. Following completion of successful development efforts, it is anticipated that the technology will be utilized in the development and commercialization by DuPont of products for use in the production of circuits for applications such as smart phones, telecom, internet infrastructure, high-speed computing and radar sensing devices.
July 6, 2009Pyralux® APR Recognized for New Product Rollout
DuPont Pyralux® APR embedded resistor laminate was featured in the Printed Circuit Design & Fab June Supplier Spotlight for receiving a 2009 New Product Introduction Award, recognizing APR as a leading new product for printed circuit design and fabrication based on innovation and creativity, compatibility with existing technology, cost-effectiveness, environmental consideration, performance and user-friendliness. »More
February 19, 2007 Picking Up the Latest Trend in Cell Phones
DuPont Electronic Technologies (ET) in Research Triangle Park, NC recently hosted The International Wireless Industry Consortium, as part of an interactive technical workshop on handset technologies for multi-mode, multi-band cell phone antenna designs, sponsored by Sony Ericsson. »More