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News & Events July 6, 2009Pyralux® APR Recognized for New Product Rollout DuPont Pyralux® APR embedded resistor laminate was featured in the Printed Circuit Design & Fab June Supplier Spotlight for receiving a 2009 New Product Introduction Award, recognizing APR as a leading new product for printed circuit design and fabrication based on innovation and creativity, compatibility with existing technology, cost-effectiveness, environmental consideration, performance and user-friendliness. »More February 3, 2009DuPont High Performance Laminates Introduces Pyralux® APR Copper Clad Resistor Laminate DuPont expands its portfolio of embedded materials and all polyimide laminates with the introduction of DuPont™ Pyralux® APR copper clad resistor laminate for advanced multi-layer flex, rigid flex and rigid printed circuit boards. »More June 11, 2008DuPont Electronic Technologies Announces Global Price Increase DuPont Electronic Technologies cites rising raw material, transportation and energy costs among its reasons for the increase. »More January 16, 2008 DuPont to Exhibit at Internepcon 2008 DuPont will feature its flexible printed circuit offering at Internepcon Japan Printed Wiring Board Expo. »More February 19, 2007 Picking Up the Latest Trend in Cell Phones DuPont Electronic Technologies (ET) in Research Triangle Park, NC recently hosted The International Wireless Industry Consortium, as part of an interactive technical workshop on handset technologies for multi-mode, multi-band cell phone antenna designs, sponsored by Sony Ericsson. »More January 18, 2007 DuPont Semiconductor Packaging and Circuit Materials Participated in InterNepcon Japan DuPont showcased its expanding portfolio of materials for Semiconductor Packaging and Circuit Materials at InterNepcon Japan 2007. »More		Events
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