The miracles of science™

Select Industry
Pyralux® Home
Products & Services
Uses & Applications
Sales & Support
News & Events
Technical Info
CONTACT US
Printer Friendly Version
DuPont Products & Services
DuPont Brands & Trademarks

News & Events

April 7, 2010
DuPont Circuit & Packaging Materials Introduces Pyralux® TK Flexible Circuit Materials for High Speed and High Frequency Printed Circuit Boards Its combination of low dielectric constant, low loss tangent, low moisture tolerance and tight thickness tolerance are unparalleled in the industry today. »More

March 15, 2010
DuPont Circuit & Packaging Materials Opens New Technical Lab in China This multi-functional lab will enable faster and more efficient technical support for CPM customers in the electronics industry in China, and provide a facility for new product development and process evaluation. »More

March 4, 2010DuPont Features New Material Innovations in Electronics at IPC APEX Expo New technologies on display will include dry film photoresists and phototooling films for printed circuit board (PCB) imaging, flexible circuit materials, embedded resistor materials and new screen printed inks for PCB fabrication. »More

February 26, 2010
DuPont Exhibits at CPCA 2010 Shanghai, China DuPont will be featuring its broad offering of technologies for the Printed Circuit Board (PCB) industry at CPCA 2010 in Shanghai, China, March 16 - 18, 2010. »More

July 6, 2009Pyralux® APR Recognized for New Product Rollout DuPont Pyralux® APR embedded resistor laminate was featured in the Printed Circuit Design & Fab June Supplier Spotlight for receiving a 2009 New Product Introduction Award, recognizing APR as a leading new product for printed circuit design and fabrication based on innovation and creativity, compatibility with existing technology, cost-effectiveness, environmental consideration, performance and user-friendliness. »More

February 3, 2009DuPont High Performance Laminates Introduces Pyralux® APR Copper Clad Resistor Laminate DuPont expands its portfolio of embedded materials and all polyimide laminates with the introduction of DuPont™ Pyralux® APR copper clad resistor laminate for advanced multi-layer flex, rigid flex and rigid printed circuit boards. »More

 

January 16, 2008 DuPont to Exhibit at Internepcon 2008 DuPont will feature its flexible printed circuit offering at Internepcon Japan Printed Wiring Board Expo.  »More

 

February 19, 2007 Picking Up the Latest Trend in Cell Phones DuPont Electronic Technologies (ET) in Research Triangle Park, NC recently hosted The International Wireless Industry Consortium, as part of an interactive technical workshop on handset technologies for multi-mode, multi-band cell phone antenna designs, sponsored by Sony Ericsson.   »More

 

January 18, 2007 DuPont Semiconductor Packaging and Circuit Materials Participated in InterNepcon Japan DuPont showcased its expanding portfolio of materials for Semiconductor Packaging and Circuit Materials at InterNepcon Japan 2007.   »More