DuPont™ Pyralux® LF coverlay composites are constructed of DuPont™ Kapton® HN polyimide film, coated on one side with a proprietary B-staged modified acrylic adhesive. Coverlay is used to encapsulate etched details in flexible and rigid-flex multilayer constructions for environmental protection and electrical insulation.
DuPont™ Pyralux® bondply composites are constructed of DuPont™ Kapton® HN polyimide film coated on both sides with a proprietary B-staged modified acrylic adhesive. Bondply is used to encapsulate two etched details for environmental protection and electrical insulation. Using bondply can eliminate a layer of Kapton and a layer of adhesive in low count multilayer constructions.
DuPont™ Pyralux® LF sheet adhesive is a proprietary B-staged modified acrylic adhesive coated on release paper. Sheet adhesive is used primarily to bond flexible innerlayers or rigid cap layers in multilayer lamination. It is also widely used to bond flexible circuits to rigid boards during the fabrication of rigid-flex circuits, as well as to bond stiffeners and heat sinks.
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| Polyimide |
12.5(1/2), 25(1), 50(2), 75(3), 100(4), 125(5) |
| Adhesive (one or both sides) |
12.5(1/2), 25(1), 50(2), 75(3), 100(4) |
| Sheet Adhesive |
12.5(1/2), 25(1), 50(2), 75(3), 100(4) |
Additional product constructions maay be available upon request.
