DuPont Pyralux® flexible composite materials : Adhesives, Coverlays & Bondply Flims

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Copper Clad Laminates Coverlay, Bondply & Sheet Adhesives Pyralux® FR Pyralux® LF Pyralux® LF-B Pyralux® LG Pyralux® HXC Pyralux® HF Pyralux® PC Nikaflex®

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Pyralux® Coverlay, Bondply & Sheet Adhesive DuPont™ Pyralux® bonding films have been a standard in the flex circuit industry for over 30 years. Coverlays consist of DuPont™ Kapton® polyimide film coated on one side with adhesive while bondplys are coated on both sides. Adhesives are provided as ‘B-stage’ films coated onto release paper. Bonding films are available with either acrylic adhesive, using Pyralux® LF or FR, or epoxy adhesive, which is available under the Nikaflex® brand name. DuPont also offers a photoimagable dry film coverlay known as Pyralux® PC. Acrylic Based Adhesives Pyralux® FR coverlay, bondply & sheet adhesive Pyralux® FR bonding films are UL rated for flame retardency, low tack for ease in handling and opaque in appearance. They can withstand multiple temperature excursions without degradation and require no refrigeration for storage. Pyralux® FR bonding films are available in roll form in a wide variety of thicknesses. » More Pyralux® FR is also available as a copper-clad laminate. Pyralux® LF coverlay, bondply & sheet adhesive Pyralux® LF bonding films are halogen-free, low tack for ease in handling and transparent in appearance. They can withstand multiple temperature excursions without degradation and require no refrigeration for storage. Pyralux® LF bonding films are available in roll form in a wide variety of thicknesses. » More Pyralux® LF is also available as a copper-clad laminate. Pyralux® LF-B black coverlay DuPont™ Pyralux® LF-B is a black polyimide coverlay based on the leading DuPont™ Pyralux® LF brand flexible circuit materials, that enables stylish 3D LED lighting systems for automotive and other applications requiring robust, color stable systems with temperature resistance up to 150°C. » More Pyralux® LG glass reinforced bonding film Pyralux® LG is an impregnated glass fabric composite primarily used in heat sink bonding applications that require additional resistance to distortion in handling. » More Epoxy-Based Adhesives Pyralux® HXC black flexible circuit material Epoxy adhesive coverlayDuPont™ Pyralux® HXC black flexible circuit material is a halogen free coverlay made with DuPont™ Kapton® MBC black polyimide film. »More Pyralux® HF Halogen free epoxy adhesive coverlayDuPont™ Pyralux® HF coverlay is used in environmental and electrical insulation applications. »More Nikaflex® epoxy coverlay & sheet adhesive Nikaflex® epoxy-based bonding films are available in roll form in metric sizes. There are three different adhesive systems with complimentary bonding films. »More Photoimagable Dry Film Pyralux® PC flexible photoimageable coverlay Pyralux PC is a photoimagable dry film used as an alternative to traditional coverlays for applications requiring fine resolution along with bend and crease flexibility. » More Nikaflex® is a registered trademark of, and used with permission of, Nikkan Industries Co., Ltd.		Helpful Links Related Industries Semiconductor Packaging & Circuit Materials Semiconductor Fabrication Materials Displays Releated Product Information Pyralux® Product Lookup Guide Frequently Asked Questions Get Answers Here!
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