DuPont™ Pyralux® bonding films have been a standard in the flex circuit industry for over 30 years. Coverlays consist of DuPont™ Kapton® polyimide film coated on one side with adhesive while bondplys are coated on both sides. Adhesives are provided as ‘B-stage’ films coated onto release paper. Bonding films are available with either acrylic adhesive, using Pyralux® LF or FR, or epoxy adhesive, which is available under the Nikaflex® brand name. DuPont also offers a photoimagable dry film coverlay known as Pyralux® PC.