DuPont Pyralux® flexible circuit materials : Flexible Laminates

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Copper Clad Laminates

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Copper Clad Laminates Pyralux® AC Pyralux® AP Pyralux® AX Pyralux® FR Pyralux® LF Nikaflex® Coverlay, Bondply & Sheet Adhesives

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Pyralux® Flexible Laminates DuPont™ Pyralux® flexible laminates are available in a broad range of copper clad constructions using a wide variety of base dielectrics. These laminates are available in either adhesive based or adhesiveless form. Adhesive based clads, also known as 3-layer, are made using DuPont™ Kapton® and are available in sheet form with either Pyralux® FR or LF acrylic adhesive. Also available, under the Nikaflex® brand name, is an epoxy adhesive based 3-layer clad in roll form. Adhesiveless clads, also known as 2-layer, are available either as double-sided using a lamination based manufacturing process or single sided utilizing cast technology. Adhesiveless Clads Pyralux® AC adhesiveless copper-clad laminate Pyralux® AC is ideal for use in display driver flexes. Its excellent dimensional stability allows for accurate registration while its high modulus allows for high dynamic flexing and reliable chip-on-flex attachment. » More Pyralux® AP adhesiveless copper-clad laminate Pyralux® AP has excellent thermal, chemical, electrical, and mechanical properties that make it ideal for use in high reliability rigid flex and multilayer flex circuitry and is commonly used in the avionics industry. » More Pyralux® AX adhesiveless copper-clad laminate Pyralux® AX is commonly used for display driver interconnects requiring double sided circuitry. Pyralux® AX is an all polyimide laminate constructed of polyimide film laminated to copper foil on both sides and is offered in metric sizes for high volume manufacturing. » More Acrylic Adhesive Based Clads Pyralux® FR copper-clad laminate Pyralux® FR is a commercial grade product ideal for industrial and telecommunication applications requiring flame retardancy. » More Pyralux® FR is also available as a coverlay, bondply or sheet adhesive . Pyralux® LF copper-clad laminate Pyralux® LF has been an industry standard in high reliability applications in the avionics industry for over 30 years and has a proven record of consistency and dependability and is ideal for aerospace and military applications. » More Pyralux® LF is also available as a coverlay, bondply or sheet adhesive. Epoxy Adhesive Based Clads Nikaflex® epoxy-based laminates Nikaflex® laminates consist of a family of epoxy-based adhesive systems used in combination with copper and DuPont™ Kapton® polyimide that are ideal for use in consumer electronics applications such as notebook computers and digital cameras. » More Nikaflex® is also available as a coverlay or sheet adhesive . Nikaflex® is a registered trademark of, and used with the permission of, Nikkan Industries Co., Ltd.		Helpful Links Releated Industries & Products Semiconductor Packaging & Circuit Materials Semiconductor Fabrication Materials Displays Interra™ embedded passives Related Product Information Pyralux® Product Lookup Guide [.xls] Frequently Asked Questions Get Answers Here!
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