DuPont™ Pyralux® AP has excellent thermal, chemical, electrical, and mechanical properties that make it ideal for use in high reliability rigid flex and multilayer flex circuitry and is commonly used in the avionics industry. Pyralux® AP is an all polyimide laminate constructed of polyimide film laminated to copper foil on both sides and is available in a wide variety of thicknesses in sheet form.
Features
- Low CTE plated through hole reliability
- Excellent thermal resistance
- High M&IR
- High tear strength
- Excellent dielectric thickness tolerance
- High peel strength
- Low outgassing, NASA data available
- UL 94 V-0 flammability rating with 180°C maximum operating temperature
- Certified to IPC 4204/11
Download the Data Sheet for Pyrlaux® AP - [English] [日本語]
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| Polyimide |
25(1), 38(1.5), 50(2), 75(3), 100(4), 125(5), 150(6), 175(7) |
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| RA Copper (both sides) |
18(1/2), 35(1), 70(2), 105(3), 140(4) |
| ED Copper (both sides) |
9(1/4), 12(1/3), 18(1/2), 35(1), 70(2) |
Additional product constructions may be available upon request.
