Wafer Level Chip Scale Packaging [.pdf]
Driven by the need for higher density devices and higher speed interconnectivity, the introduction of copper and redistribution layers in these packages created new challenges for the permanent dielectric layer. The solution: HD MicroSystems™ developed a new generation of liquid polyimides, HD-4100, that addressed the unique requirements of WL-CSP applications utilizing copper redistribution layers.
DuPont™ Vespel® Extends the Life of Chamber Liners [.pdf]
The Challenge: Improve longevity of chamber liners for semiconductor and high purity applications. The Solution: DuPont™ Vespel® TP 8005 plasma components specifically designed for endurance, low outgassing and high level of cleanliness.
Fermentation Lab’s New Tubing Cleans Easily, Shows Flow [.pdf]
The fermentation facility producing biological agents for one of the world’s leading biotechnology research and development efforts is relying on tubing and fittings made of DuPont™ Teflon® PFA fluoropolymer resin instead of stainless steel for two key applications.