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Semiconductor Fabrication materials from DuPont

Semiconductor Fabrication Materials

Lithography

DuPont offers electronic grade polymers for the manufacture of advanced photoresists, and photosensitive liquid polyimide and PBO formulations for the formation of dielectric layers that can also serve as photoresists. Photoresist performance depends largely on the properties of the polymer used in the resist formulation. Our electronic grade polymers are produced under stringently controlled conditions and are thoroughly tested to ensure highest performance in critical applications, and batch-to-batch consistency.

Our materials for lithography include:

Polymers for Photoresist DuPont Electronic Polymers has produced poly(hydroxystyrene) based polymers since the early 1980’s.

  • PHS based polymers for 248 nm photoresist
    Our deep understanding of polymer assembly and architecture enables us to modify or develop new polymers for specific customer needs, ranging from thick film applications to fine line (<100 nm), critical layer applications.
  • Polymers for 193 nm photoresist
    Targeting the 65nm node and below, polymers prepared with High Compositional Uniformity (HCU™) technology or Reversible Addition Fragmentation Chain Transfer (RAFT) polymerization can enable a superior resist formulation.

 

 

Photosensistive Liquid Polyimide
and PBO Formulations
 

Polyimide or PBO films, from HD MicroSystems, are formed by spin coating and used as a dielectric, or as a "stress buffer" protective overcoat for semiconductors prior to encapsulation. Several photodefineable formulations can also serve a photoresist in back-of-the-line and  packaging applications.

 

 

Aluminum Post-Etch Residue Removers The development of conventional cleaning solutions is based on balancing the etch selectivity towards metals and dielectrics with the efficiency of removing residues. New solutions have been developed to decrease Aluminum and Titanium etch rates while maintaining performance for post-etch residue removal. Design of experiment (DOE) techniques have been used to develop a broad range of new formulations optimized for low metal etch rates.  » Find Out More

 

WLP Photoresist Removers & TSV Cleaners Formulations optimized to effectively remove liquid or dry film photoresists used for Through Silicon Via (TSV) masks and Wafer Level Packaging (WLP) applications like wafer bumping by electroplating or stencil printing. TSV cleaners are designed to be compatible with copper and to effectively remove residues after TSV etch. 
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Specialty Applications The broad photoresist removal product portfolio from DuPont EKC Technology allows effective cleaning of photoresists used in both patterning and metal lift-off applications. Specialty applications where DuPont EKC Technology products are currently used include medical devices, LEDs (light emitting diodes), hard disk drives, photovoltaics and high-frequency or power devices (III/V).  » Find Out More