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Semiconductor Fabrication materials from DuPont

Semiconductor Fabrication Materials

Semiconductor Packaging

DuPont offers a broad and growing portfolio of innovative materials technologies for both ("first level") semiconductor packaging and ("second level") circuit applications. These cover rigid and flexible printed circuit board manufacturing to ceramic and wafer based processing. We are uniquely positioned to address the increasingly more complex performance requirements through our broad corporate technology base spanning polymers, fibers, photopolymers, dispersions, coatings and film making.

To learn more about offerings in this area, please visit our Semiconductor Packaging & Circuit Materials web site.