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Semiconductor Fabrication Materials

Chemical Mechanical Planarization (CMP)

Chemical Mechanical Planarization (CMP) is a process used to smooth (or “planarize”) a macroscopically flat silicon wafer at the device level.  This process is critical in establishing reliable multilevel interconnects in the fabrication of integrated circuits. 

DuPont, through its joint venture, DuPont Air Products NanoMaterials, offers a variety of CMP and Wafer Polishing slurries. In addition, DuPont also offers post-CMP cleaning solutions.

Our CMP materials include:

CMP Slurries 

DuPont Air Products NanoMaterials provides a broad range of colloidal silica, ceria and alumina-based custom slurries that continues to advance performance in the following applications:

  • Copper
  • Barrier
  • Tungsten
  • Shallow Trench Isolation (STI)
  • Inter Layer Dielectric (ILD) and
    Post-Metal Dielectric (PMD)
  • Specialty Films
  • Phasechange Random Access Memory PRAM (GST/IST) 
  • 3D Packaging / Through Silicon Via (TSV)
»  Find Out More

 

Wafer Polishing Slurries DuPont Air Products NanoMaterials’ Wafer Polish portfolio contains a selection of formulated colloidal silica-based slurries used in silicon wafer applications. »  Find Out More

 

Post CMP Cleaners Post CMP cleaning is a yield enhancing process step that removes defects deposited during the planarization process. DuPont offers cleaning solutions for use following tungsten, copper and STI CMP providing outstanding results, including removal of residual metals and particles.»  Find Out More