Chemical Mechanical Planarization (CMP) is a process used to smooth (or “planarize”) a macroscopically flat silicon wafer at the device level. This process is critical in establishing reliable multilevel interconnects in the fabrication of integrated circuits.
DuPont, through its joint venture, DuPont Air Products NanoMaterials, offers a variety of CMP and Wafer Polishing slurries. In addition, DuPont also offers post-CMP cleaning solutions.
Our CMP materials include: