Chemical Mechanical Planarization (CMP) is a process used to smooth (or “planarize”) a macroscopically flat silicon wafer at the device level. This process is critical in establishing reliable multilevel interconnects in the fabrication of integrated circuits.
DuPont offers post-CMP cleaning solutions that remove defects deposited during the planarization process.
Post CMP Cleaners Post CMP cleaning is a yield enhancing process step that removes defects deposited during the planarization process. DuPont offers cleaning solutions for use following tungsten, copper and STI CMP providing outstanding results, including removal of residual metals and particles.»Find Out More