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Semiconductor Fabrication materials from DuPont

Semiconductor Fabrication Materials

Applications

Chemical Mechanical Planarization (CMP)

CMP slurries, cleaning chemicals, and infrastructure components and materials for CMP processes.

 

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Lithography

Electronic grade polymers for the manufacture of advanced photoresists, and photosensitive liquid polyimide and PBO formulations for the formation of dielectric layers that can be photoimaged and also serve as photoresists..

 

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Etch & Clean

Post-etch residue removers, post-CMP cleaning, chamber clean gases, wet chemicals, and infrastructure components and materials for etch and clean processes.

 

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Back End of Line (BEOL) & Wafer Level Packaging (WLP)

Integrated wafer level packaging solutions for both current and emerging wafer level packaging requirements, including 3D and Through Silicon Via (TSV) technologies..

 

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Semiconductor Packaging

Materials for advanced semiconductor packaging, including Wafer Level Packaging

 

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Components, Parts & Accessories

Gaskets, Seals, O-rings and stock shapes to enable high purity and enhanced safety and equipment performance, and elastomers and resins used for pipe, tubing, hose, flanges, connectors, couplings and fittings.

 

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Infrastructure Materials

HVAC refrigerants, contamination control solutions, clean agent fire extinguishants, materials for exhaust ducting, and waste handling piping.

 

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Support Materials

Products for use in controlled environments, for personal protection, cleaning solutions & solvents, device & wafer handling systems, and lubricants designed to improve the overall safety, efficiency, and cost of ownership of fabrication operations.

 

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