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News Archive - 2005
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News & Events

News Archive - 2005

August 30, 2005 Connected by Science: DuPont Semiconductor Materials A team comprised of more than 10 DuPont business units, including: DuPont Electronic Technologies, DuPont Fluoroproducts, DuPont Engineering Polymers, and DuPont Performance Elastomers recently united as "One DuPont" to exhibit its range of semiconductor materials at Semicon West in San Francisco, California.   » More

July 22, 2005 DuPont Electronic Technologies and Sanmina-SCI Sign Licensing Agreement for DuPont™ Interra™ Embedded Passive Materials Use in Buried Capacitance® Technology DuPont Electronic Technologies today announced an agreement with Sanmina-SCI to become a licensee of Sanmina-SCI's patented Buried Capacitance® technology. DuPont™ Interra™ HK polyimide laminates can now be used in the practice of Buried Capacitance® technology, available to Sanmina-SCI's existing family of licensed printed circuit board (PCB) manufacturers.   » More

July 12, 2005 DuPont Fluoroproducts Introduces New Permeation Resistant Grade Teflon® PFA HP Plus Flouropolymer Resin The new resin, Teflon® PFA 951HP Plus, is designed for molding and extrusion for fluid handling components and tubing, and cuts hydrochloric acid (HCl) permeation by up to 40 percent to ensure durability and longer life, lowering the cost of equipment ownership for semiconductor manufacturers.   » More

July 12, 2005 DuPont™ Vespel® Grade Helps Get Rid of Static Charges DuPont™ Vespel® SP-202 polyimide parts and shapes have what it takes to combat static charge buildup in the fabrication and handling of flat panel glass, semiconductor wafers and other products handled in high-temperature, vacuum or reactive environments manufacturers.   » More

July 12, 2005 DuPont Increases Industry Involvement in Semiconductor Materials DuPont today announced that John E. Odom, president, EKC Technology, a unit of DuPont Electronic Technologies, has been selected as vice chairman of the SEMI® Chemicals and Gas Manufacturers Group.   » More

July 11, 2005 DuPont Air Products NanoMaterials Introduces New DCmP™ Formulations DuPont Air Products NanoMaterials (DA NanoMaterials) today announced the introduction of DCmP™, a new type of formulation for copper and tungsten chemical mechanical planarization (CMP) slurries.   » More

July 7, 2005 Major Resin Expansion to Serve Growth of DuPont™ Vespel® Polyimide Parts Keeping pace with rising demand for DuPont™ Vespel® parts and shapes, the company’s Vespel® business unit is expanding its polyimide resin production facility in Circleville, Ohio.   » More